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1.发明申请公开(公告)号：US20100308509A1
公开(公告)日：2010-12-09
申请号：US12675217
申请日：2008-09-05
CPC分类号： C23C16/401 , B29C33/3857 , B29C33/405 , B29C33/58 , B29K2083/005 , B29K2105/0082 , G02B1/118
摘要： A method of forming a working mold including: placing a substrate (610) on an electrode in a chamber, the substrate having at least a first structured surface (620) and the substrate including a thermoset polymeric material; introducing a release (630) layer forming gas into the chamber, wherein the release layer forming gas includes silicon containing gas and oxygen gas in an atomic ratio of not greater than about 200; providing power to the electrode to create a plasma of the release layer forming gas within the chamber; and depositing a release layer formed from the release layer forming gas on at least the first structured surface of the substrate to form a working mold.
摘要翻译： 一种形成工作模具的方法，包括：将基板（610）放置在室中的电极上，所述基板具有至少第一结构化表面（620），并且所述基板包括热固性聚合材料; 将形成气体的释放层（630）引入所述室中，其中所述释放层形成气体包括原子比不大于约200的含硅气体和氧气; 向电极提供电力以产生在室内形成气体的释放层的等离子体; 以及在所述基板的至少所述第一结构化表面上沉积由所述释放层形成气体形成的释放层以形成工作模具。
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2.发明申请公开(公告)号：US20100239783A1
公开(公告)日：2010-09-23
申请号：US12675570
申请日：2008-09-05
IPC分类号： H05H1/24
CPC分类号： C23C16/401 , B29C33/3857 , B29C33/405 , B29C33/58 , B29K2083/005 , B29K2105/0082 , G02B1/118
摘要： A method of forming a working mold including placing a substrate near an electrode in a chamber, the substrate (610) having at least a first structured surface (620); providing power to the electrode to create a plasma, —introducing vapor of liquid silicone molecules into the plasma; and depositing a release layer (630), the release layer (630) including a silicone containing polymer, the release layer (630) being deposited on at least a portion of the first structured surface of the substrate to form the working mold.
摘要翻译： 一种形成工作模具的方法，包括将电极附近的基板放置在室中，所述基板（610）至少具有第一结构化表面（620）; 向电极提供电力以产生等离子体，将液体硅酮分子的蒸气引入等离子体中; 以及沉积释放层（630），所述释放层（630）包括含硅氧烷的聚合物，所述释放层（630）沉积在所述基底的所述第一结构化表面的至少一部分上以形成所述工作模具。
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