摘要:
A process for preparing an organic film comprising the steps of ejecting an organic material in a gaseous state from an injection nozzle into a vacuum region to form clusters due to adiabatic expansion, subjecting the clusters to an intermediate state necessary for forming polymers due to abstraction and the like occurring in a part of atoms forming the clusters, and effecting polymerization reaction of the clusters on a substrate, thereby to form a dense organic film of a high quality and a high bonding strength.
摘要:
A continuous kneader includes a screw shaft rotatable within a cylinder, and rotatable disks fixedly mounted on the shaft for rotation therewith. Stationary disks are arranged in face-to-face opposed relation to the rotatable disks. Each of the opposed surfaces of the disks is formed with alternating ridges and furrows. The material is passed between the opposed disk surfaces while being subjected alternately to compressive and shearing forces. Grooves are formed in the inner peripheral surface of the stationary disk and a screw section is carried on the adjacent outer peripheral surface of the drive shaft to promote the axial advance of the material through the device.
摘要:
A method of forming a working mold including: placing a substrate (610) on an electrode in a chamber, the substrate having at least a first structured surface (620) and the substrate including a thermoset polymeric material; introducing a release (630) layer forming gas into the chamber, wherein the release layer forming gas includes silicon containing gas and oxygen gas in an atomic ratio of not greater than about 200; providing power to the electrode to create a plasma of the release layer forming gas within the chamber; and depositing a release layer formed from the release layer forming gas on at least the first structured surface of the substrate to form a working mold.
摘要:
A method of forming a working mold including placing a substrate near an electrode in a chamber, the substrate (610) having at least a first structured surface (620); providing power to the electrode to create a plasma, —introducing vapor of liquid silicone molecules into the plasma; and depositing a release layer (630), the release layer (630) including a silicone containing polymer, the release layer (630) being deposited on at least a portion of the first structured surface of the substrate to form the working mold.
摘要:
A method of forming a working mold including placing a substrate near an electrode in a chamber, the substrate (610) having at least a first structured surface (620); providing power to the electrode to create a plasma, —introducing vapor of liquid silicone molecules into the plasma; and depositing a release layer (630), the release layer (630) including a silicone containing polymer, the release layer (630) being deposited on at least a portion of the first structured surface of the substrate to form the working mold.
摘要:
A method of forming a working mold including: placing a substrate (610) on an electrode in a chamber, the substrate having at least a first structured surface (620) and the substrate including a thermoset polymeric material; introducing a release (630) layer forming gas into the chamber, wherein the release layer forming gas includes silicon containing gas and oxygen gas in an atomic ratio of not greater than about 200; providing power to the electrode to create a plasma of the release layer forming gas within the chamber; and depositing a release layer formed from the release layer forming gas on at least the first structured surface of the substrate to form a working mold.
摘要:
Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.
摘要:
A method of forming a heat shield that involves thermally stabilizing a plurality of phenolic microspheres; mixing the thermally stabilized phenolic microspheres with a phenolic resin to form a phenolic ablative material; compressing the phenolic ablative material into a honeycomb core; and allowing the phenolic ablative material to cure.
摘要:
A method of forming a heat shield that involves thermally stabilizing a plurality of phenolic microspheres; mixing the thermally stabilized phenolic microspheres with a phenolic resin to form a phenolic ablative material; compressing the phenolic ablative material into a honeycomb core; and allowing the phenolic ablative material to cure.
摘要:
Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.