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公开(公告)号：US07692119B2
公开(公告)日：2010-04-06
申请号：US11476851
申请日：2006-06-29
CPC分类号： B23K1/008
摘要： In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.
摘要翻译： 在设置在炉入口和加热室之间的第一缓冲区中，环境气体从载体装置的下侧吹送到印刷电路板，而环境气体被吸入载体装置的上侧 因此防止外部空气渗透，并且防止环境气体流出。 此外，通过将助熔剂落下防止机构安装在环境气体的吸入口中，可防止焊剂附着在印刷电路板上。
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公开(公告)号：US20070045382A1
公开(公告)日：2007-03-01
申请号：US11476851
申请日：2006-06-29
IPC分类号： B23K1/00
CPC分类号： B23K1/008
摘要： In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.
摘要翻译： 在设置在炉入口和加热室之间的第一缓冲区中，环境气体从载体装置的下侧吹送到印刷电路板，而环境气体被吸入载体装置的上侧 因此防止外部空气渗透，并且防止环境气体流出。 此外，通过将助熔剂落下防止机构安装在环境气体的吸入口中，可防止焊剂附着在印刷电路板上。
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公开(公告)号：US20070042313A1
公开(公告)日：2007-02-22
申请号：US11476874
申请日：2006-06-29
申请人： Motomu Shibamura , Atsushi Tanaka
发明人： Motomu Shibamura , Atsushi Tanaka
IPC分类号： F27D3/00
CPC分类号： F27B9/3005 , F27B9/20 , F27B9/36 , F27D7/04
摘要： In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.
摘要翻译： 在设置在炉入口和加热室之间的第一缓冲区中，环境气体从载体装置的下侧吹送到印刷电路板，而环境气体被吸入载体装置的上侧 因此防止外部空气渗透，并且防止环境气体流出。 此外，通过将助熔剂落下防止机构安装在环境气体的吸入口中，可防止焊剂附着在印刷电路板上。
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公开(公告)号：US07442037B2
公开(公告)日：2008-10-28
申请号：US11476874
申请日：2006-06-29
申请人： Motomu Shibamura , Atsushi Tanaka
发明人： Motomu Shibamura , Atsushi Tanaka
IPC分类号： F27B9/10
CPC分类号： F27B9/3005 , F27B9/20 , F27B9/36 , F27D7/04
摘要： In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.
摘要翻译： 在设置在炉入口和加热室之间的第一缓冲区中，环境气体从载体装置的下侧吹送到印刷电路板，而环境气体被吸入载体装置的上侧 因此防止外部空气渗透，并且防止环境气体流出。 此外，通过将助熔剂落下防止机构安装在环境气体的吸入口中，可防止焊剂附着在印刷电路板上。
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5.发明授权公开(公告)号：US09078358B2
公开(公告)日：2015-07-07
申请号：US13526015
申请日：2012-06-18
CPC分类号： H05K1/0263 , H05K1/0271 , H05K2201/09063 , H05K2201/09072
摘要： A substrate (1) includes conductive portions (7) formed by press working and a resin portion (11) integrally injection-molded with the conductive portions (7). The conductive portions (7) are formed from, for example, a copper alloy. The resin portion 11 is formed from, for example, PPS. A surface-mount component (3), which is an electronic surface-mount component, is mounted on the substrate (1). The surface-mount component (3) has electrodes (5) at its opposite sides, and the electrodes (5) and the respective conductive portions (7) are electrically connected by means of a solder (9). The substrate (1) has a hole (13), which functions as a stress relaxation mechanism, formed in the resin portion (11) (a portion extending therethrough) between connection portions (15) under the surface-mount component (3). The substrate (1) also has resin-exposed portions (13), which function as a stress relaxation mechanism, formed on opposite sides of the surface-mount component (3).
摘要翻译： 基板（1）包括通过冲压加工形成的导电部分（7）和与导电部分（7）整体注模的树脂部分（11）。 导电部（7）例如由铜合金形成。 树脂部11由例如PPS形成。 作为电子表面安装部件的表面安装部件（3）安装在基板（1）上。 表面安装部件（3）在其相对侧具有电极（5），电极（5）和相应的导电部分（7）通过焊料（9）电连接。 基板（1）具有在表面安装部件（3）下方的连接部（15）之间形成在树脂部（11）（贯穿其中的部分）上的作为应力松弛机构的孔（13）。 基板（1）还具有形成在表面安装部件（3）的相对侧上的用作应力松弛机构的树脂暴露部分（13）。
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