-
公开(公告)号：US20210288392A1
公开(公告)日：2021-09-16
申请号：US16838664
申请日：2020-04-02
发明人： Wei Xin , Martin Rabindra Pais , MD Rashidul Islam
摘要： Implementations for heat structure for thermal mitigation are described. The described heat structures, for instance, provide a multi-layered structure that optimizes heat spreading and dissipation, as well as wireless performance of wireless devices. A heat structure, for instance, is installed internally in a wireless device adjacent various internal components to absorb heat generated by the components, and to dissipate the heat. According to various implementations, a heat structure is implemented as a thermally conductive layer surrounded by layers of electrically conductive material. Electrically conductive vias can be formed that traverse the thermally conductive layer and form an electrical connection between different electrically conductive layers to mitigate current flow in the thermally conductive layer.
-
公开(公告)号：US11165131B2
公开(公告)日：2021-11-02
申请号：US16838664
申请日：2020-04-02
发明人： Wei Xin , Martin Rabindra Pais , MD Rashidul Islam
摘要： Implementations for heat structure for thermal mitigation are described. The described heat structures, for instance, provide a multi-layered structure that optimizes heat spreading and dissipation, as well as wireless performance of wireless devices. A heat structure, for instance, is installed internally in a wireless device adjacent various internal components to absorb heat generated by the components, and to dissipate the heat. According to various implementations, a heat structure is implemented as a thermally conductive layer surrounded by layers of electrically conductive material. Electrically conductive vias can be formed that traverse the thermally conductive layer and form an electrical connection between different electrically conductive layers to mitigate current flow in the thermally conductive layer.
-
搜索结果
2 条记录 (耗时 0.01 秒)
