公开(公告)号：US20130106530A1

公开(公告)日：2013-05-02

申请号：US13616265

申请日：2012-09-14

申请人： Motoyuki TAJIMA ,  Tooru TAKEZAKI ,  Hitoshi TSUKIDATE

发明人： Motoyuki TAJIMA ,  Tooru TAKEZAKI ,  Hitoshi TSUKIDATE

IPC分类号： H03H9/70 ,  H03H9/72

CPC分类号： H03H9/0571 ,  H03H9/0576 ,  H03H9/1014 ,  H03H9/1042 ,  H03H9/1071 ,  H03H9/1085

摘要： An acoustic wave device includes: a multilayer structure that has plural surfaces which principal surfaces of plural layers provide; a chip including an acoustic wave filter and mounted on a first surface; a resin unit sealing the chip; a wiring pattern that is formed on a second surface and electrically connected to at least one of resonators; a ground pattern that is formed on the second surface along a part of the wiring pattern, and is away from the wiring pattern; and an external terminal that is formed on a third surface and electrically connected to the wiring pattern and the ground pattern, the third surface being disposed on an opposite side of the first surface with respect to the second surface; wherein a part of the wiring pattern that comes closest to the ground pattern is substantially formed in parallel with the ground pattern.

摘要翻译： 声波装置包括：多层结构，其具有多层提供的主表面的多个表面; 包括声波滤波器并安装在第一表面上的芯片; 密封芯片的树脂单元; 形成在第二表面上并与至少一个谐振器电连接的布线图案; 沿着所述布线图形的一部分形成在所述第二表面上并且远离所述布线图案的接地图案; 以及外部端子，其形成在第三表面上并且电连接到所述布线图案和所述接地图案，所述第三表面相对于所述第二表面设置在所述第一表面的相对侧上; 其中最靠近接地图案的布线图案的一部分基本上与接地图形平行地形成。