公开(公告)号：US20120199469A1

公开(公告)日：2012-08-09

申请号：US13024198

申请日：2011-02-09

Applicant: Muhammad M. RASHEED ,  Rongjun WANG

Inventor： Muhammad M. RASHEED ,  Rongjun WANG

IPC: C23C14/14 ,  C23C14/34

CPC classification number: C23C14/3407 ,  C22C9/00 ,  C22C9/04 ,  C22C19/03 ,  C23C14/3414 ,  H01J37/3426 ,  H01J37/3435

Abstract: Embodiments of the invention provide sputtering targets utilized in physical vapor deposition (PVD) and methods to form such sputtering targets. In one embodiment, a sputtering target contains a target layer disposed on a backing plate, and a protective coating layer—usually containing a nickel material—covering and protecting a region of the backing plate that would otherwise be exposed to plasma during the PVD processes. In many examples, the target layer contains a nickel-platinum alloy, the backing plate contains a copper alloy (e.g., copper-zinc), and the protective coating layer contains metallic nickel. The protective coating layer eliminates the formation of highly conductive, copper contaminants typically derived by plasma erosion of the copper alloy contained within the exposed surfaces of the backing plate. Therefore, the substrates and the interior surfaces of the PVD chamber remain free of such copper contaminants during the PVD processes.

Abstract translation: 本发明的实施例提供了用于物理气相沉积（PVD）的溅射靶和形成这种溅射靶的方法。 在一个实施例中，溅射靶包含设置在背板上的目标层和通常包含镍材料覆盖层并保护背衬板的区域的保护涂层，否则在PVD工艺期间将暴露于等离子体的区域。 在许多实施例中，靶层含有镍 - 铂合金，背板含有铜合金（例如铜 - 锌），保护涂层含有金属镍。 保护涂层消除了形成高度导电的铜污染物，通常由包含在背板的暴露表面内的铜合金的等离子体侵蚀导致。 因此，在PVD工艺期间，PVD室的基板和内表面保持没有这种铜污染物。

公开(公告)号：US20090261276A1

公开(公告)日：2009-10-22

申请号：US12107281

申请日：2008-04-22

Applicant: Dmitry LUBOMIRSKY ,  Muhammad M. RASHEED ,  Ellie Y. YIEH

Inventor： Dmitry LUBOMIRSKY ,  Muhammad M. RASHEED ,  Ellie Y. YIEH

IPC: G21G5/00 ,  H01J9/00

CPC classification number: H01L21/67115 ,  H01L21/3105 ,  H01S3/03 ,  H01S3/034 ,  H01S3/0385 ,  H01S3/225 ,  H05H1/2406 ,  H05H2001/2431 ,  H05H2001/245

Abstract: An apparatus for An apparatus for generating excimer radiation is provided. The apparatus includes a housing having a housing wall. An electrode is configured within the housing. A tubular body is around the electrode. The tubular body includes an outer wall and an inner wall. At least one inert gas is between the outer wall and the inner wall, wherein the housing wall and the electrode are configured to excite the inert gas to illuminate an excimer light for curing.

Abstract translation: 提供了一种用于产生准分子辐射的装置。 该装置包括具有壳体壁的壳体。 电极配置在外壳内。 管状体在电极周围。 管状体包括外壁和内壁。 至少一个惰性气体位于外壁和内壁之间，其中壳体壁和电极构造成激发惰性气体以照射准分子光以进行固化。

公开(公告)号：US20220344134A1

公开(公告)日：2022-10-27

申请号：US17861324

申请日：2022-07-11

Applicant: Muhannad MUSTAFA ,  Muhammad M. RASHEED ,  Yu LEI ,  Avgerinos V. GELATOS ,  Vikash BANTHIA ,  Victor H. CALDERON ,  Shi Wei TOH ,  Yung-Hsin LEE ,  Anindita SEN

Inventor： Muhannad MUSTAFA ,  Muhammad M. RASHEED ,  Yu LEI ,  Avgerinos V. GELATOS ,  Vikash BANTHIA ,  Victor H. CALDERON ,  Shi Wei TOH ,  Yung-Hsin LEE ,  Anindita SEN

IPC: H01J37/32

Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, a process kit for a substrate support includes: an upper edge ring made of quartz and having an upper surface and a lower surface, wherein the upper surface is substantially planar and the lower surface includes a stepped lower surface to define a radially outermost portion and a radially innermost portion of the upper edge ring.