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    Integrated circuit package design
    1.
    发明授权
    Integrated circuit package design 有权
    集成电路封装设计

    公开(公告)号：US07352062B2

    公开(公告)日：2008-04-01

    申请号：US10979491

    申请日：2004-11-02

    申请人： Mukul A. Joshi ,  Mohan R. Nagar ,  Sarathy Rajagopalan

    发明人： Mukul A. Joshi ,  Mohan R. Nagar ,  Sarathy Rajagopalan

    IPC分类号： H01L23/10 ,  H01L23/34

    CPC分类号： H01L23/36 ,  H01L23/42 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2224/0401

    摘要： A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package substrate, where the stiffener has a non-orthogonal cut out in which the integrated circuit is disposed. The edges of the cut out are disposed at no greater a distance from the corners of the integrated circuit than they are from the sides of the integrated circuit.

    摘要翻译： 一种封装集成电路，包括具有用于接收集成电路的电触点的封装基板。 集成电路电连接到封装衬底的电触头。 加强件安装到封装基板上，其中加强件具有非正交切口，集成电路设置在其中。 切出的边缘设置在与集成电路的侧面不同于集成电路的角落的距离以上。