公开(公告)号：US20210118614A1

公开(公告)日：2021-04-22

申请号：US17137498

申请日：2020-12-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukihiro FUJITA ,  Shogo KANBE ,  Kosuke NAKANO ,  Hideki OTSUKA

IPC: H01G2/06 ,  H01G4/232 ,  H01G4/30

Abstract: A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.

公开(公告)号：US20230274881A1

公开(公告)日：2023-08-31

申请号：US18195426

申请日：2023-05-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukihiro FUJITA ,  Shogo KANBE ,  Kosuke NAKANO ,  Hideki OTSUKA

IPC: H01G2/06 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H01G4/12

Abstract: A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.

公开(公告)号：US20190355522A1

公开(公告)日：2019-11-21

申请号：US16529881

申请日：2019-08-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shogo KANBE ,  Masahiro ANDATSU ,  Kosuke NAKANO ,  Hideki OTSUKA

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G2/02

Abstract: A multilayer ceramic electronic component includes a laminate including external electrodes connected to a pair of metal terminals through a bonding material. Each of the pair of metal terminals includes a terminal body, an extension portion, and a mounting portion. The terminal body includes side-surface ribs, opposed to the side surfaces of the electronic component body. The bonding material is provided between the side-surface ribs and the external electrode opposed to the side-surface rib and is not provided between the terminal body and the end surface center portion of the external electrode.

公开(公告)号：US20190287719A1

公开(公告)日：2019-09-19

申请号：US16427551

申请日：2019-05-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukihiro FUJITA ,  Shogo KANBE ,  Kosuke NAKANO ,  Hideki OTSUKA

IPC: H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/33

Abstract: A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.