公开(公告)号：US20230223970A1

公开(公告)日：2023-07-13

申请号：US18183331

申请日：2023-03-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takanori UEJIMA ,  Dai NAKAGAWA ,  Yukiya YAMAGUCHI ,  Yuji TAKEMATSU ,  Motoji TSUDA ,  Mayuka ONO ,  Hiroki FUJIWARA ,  Kiyoshi AIKAWA ,  Takashi YAMADA

IPC: H04B1/03 ,  H04B1/08

CPC classification number: H04B1/03 ,  H04B1/08 ,  H01Q1/38

Abstract: In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.