HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

    公开(公告)号:US20230402996A1

    公开(公告)日:2023-12-14

    申请号:US18457444

    申请日:2023-08-29

    CPC classification number: H03H9/6433 H03H9/542

    Abstract: To suppress degradation of characteristics, a high frequency module includes a mounting substrate, a first signal terminal, a second signal terminal, and ground terminals, and a hybrid filter. The hybrid filter is coupled between the first signal terminal and the second signal terminal. The hybrid filter includes an acoustic wave filter having at least one acoustic wave resonator, a first inductor, and a capacitor. The pass band width of the hybrid filter is larger than that of the acoustic wave resonator. A resin layer is disposed on a first principal surface of the mounting substrate. The resin layer covers at least part of the acoustic wave filter. A metal electrode layer covers at least part of the resin layer, and is coupled to the ground terminals. The second inductor is coupled between the hybrid filter and the second signal terminal.

    FILTER DEVICE, MULTIPLEXER, AND COMMUNICATION DEVICE

    公开(公告)号:US20220006443A1

    公开(公告)日:2022-01-06

    申请号:US17358484

    申请日:2021-06-25

    Inventor: Keisuke NISHIO

    Abstract: A filter includes first and second input/output terminals; an LC parallel resonance circuit that includes an inductor L1 and a capacitor C1 connected to each other in parallel; and an acoustic wave series resonance circuit that includes series arm resonators s1 and s2 connected to each other in series. The LC parallel resonance circuit and the acoustic wave series resonance circuit are connected to each other in series between the first input/output terminal and the second input/output terminal.

    FILTER DEVICE AND MULTIPLEXER
    3.
    发明申请

    公开(公告)号:US20200177154A1

    公开(公告)日:2020-06-04

    申请号:US16694446

    申请日:2019-11-25

    Abstract: A filter device having a pass band and a stop band on a lower frequency side than the pass band includes a filter having a pass band including the pass band, a series arm resonator connected in series to the filter, a first inductor directly connected in series to the series arm resonator, and a parallel arm resonator connected between a node on a path connecting the filter and the series arm resonator and the ground. The parallel arm resonator constitutes a resonance circuit having a resonant frequency at which an attenuation pole corresponding to a high frequency end of the first stop band, and the series arm resonator and the inductor constitute a resonance circuit having an anti-resonant frequency on a lower frequency side than the pass band and having a sub-resonant frequency higher than a resonant frequency of the resonance circuit.

    RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

    公开(公告)号:US20230112175A1

    公开(公告)日:2023-04-13

    申请号:US17818990

    申请日:2022-08-11

    Abstract: In a radio-frequency module, a hybrid filter includes an acoustic wave filter including at least one acoustic wave resonator, an inductor having a winding portion, and a capacitor. A plurality of outer electrodes of the acoustic wave filter includes a first input and output electrode connected to a first signal terminal, a second input and output electrode connected to a second signal terminal, and a ground electrode connected to a ground terminal. The inductor is disposed on a first major surface of a mounting substrate and is adjacent to the acoustic wave filter in plan view in a thickness direction of the mounting substrate. When viewed in a direction of a winding axis of the winding portion of the inductor, an inner part of the winding portion in the inductor does not overlap any of the first input and output electrode, the second input and output electrode, and ground electrode.

    RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS

    公开(公告)号:US20240259036A1

    公开(公告)日:2024-08-01

    申请号:US18426396

    申请日:2024-01-30

    Inventor: Keisuke NISHIO

    CPC classification number: H04B1/0057 H03H1/0007

    Abstract: A radio-frequency module includes a mounting substrate having a first main surface, an electronic component, and a second receive filter. The electronic component includes a transmit filter and a first receive filter and is disposed on the first main surface of the mounting substrate. The second receive filter is stacked on the electronic component. The pass band of the transmit filter and that of the second receive filter do not exactly match each other. In a plan view in a thickness direction of the mounting substrate, a first region of the electronic component where the first receive filter is located overlaps or matches the second receive filter, and a second region of the electronic component where the transmit filter is located overlaps none of filters disposed on the first main surface of the mounting substrate.

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