公开(公告)号：US20220285082A1

公开(公告)日：2022-09-08

申请号：US17750430

申请日：2022-05-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiminori KOUNO ,  Koji KAMADA

IPC: H01F27/28 ,  H01F27/29 ,  H05K1/02 ,  H05K1/16 ,  H05K3/46

Abstract: A multilayer board includes a first insulator layer including a first coil pattern thereon, a second insulator layer including a second coil pattern thereon, a third insulator layer including a third coil pattern thereon, a first terminal on the first insulator layer and connected to one end of the first coil pattern, a first floating pattern on the first insulator layer and not connected to the first coil pattern, and a second terminal on the third insulator layer and connected to one end of the third coil pattern. The first, second, and third insulator layers are sequentially laminated. The first, second, and third coil patterns are respectively electrically connected in sequence. The first floating pattern overlaps the second coil pattern when viewed from a laminating direction.