公开(公告)号：US20220416425A1

公开(公告)日：2022-12-29

申请号：US17901018

申请日：2022-09-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koji KAMADA ,  Kunihiro KOMAKI ,  Masahiro IZAWA ,  Ryo KOMURA

IPC: H01Q9/04 ,  H05K1/16 ,  H01Q1/48

Abstract: An element assembly has a structure in which insulator layers including first and second insulator layers are laminated in an up-down direction. The first insulator layer is above the second insulator layer. A radiant conductor layer is on an upper surface of the first insulator layer. A first capacitance defining portion includes a first interlayer connection conductor passing through one or more of the insulator layers in the up-down direction. The first interlayer connection conductor is electrically connected to the radiant conductor layer. The radiant conductor layer, a ground conductor, and the first capacitance defining portion define and function as a patch antenna. When the first interlayer connection conductor is electrically connected to the radiant conductor layer, a distance from a lower end of the first interlayer connection conductor to the ground conductor in the up-down direction is shorter than a distance from the radiant conductor layer to the ground conductor in the up-down direction.

公开(公告)号：US20190297726A1

公开(公告)日：2019-09-26

申请号：US16438519

申请日：2019-06-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirokazu YAZAKI ,  Keito YONEMORI ,  Takanori TSUCHIYA ,  Koji KAMADA ,  Takashi NOMA

IPC: H05K1/11 ,  H05K1/14 ,  H01R12/62 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

Abstract: An interposer substrate includes a body, first to third external connection conductors, and a wiring conductor. The body includes first to third principal surfaces. A distance between the first and second principal surfaces is different from a distance between the first and third principal surfaces. The first external connection conductor is provided on the first principal surface and is connected to an external circuit board. The second external connection conductor is provided on the second principal surface and is connected to a first flat cable. The third external connection conductor is provided on the third principal surface and is connected to a second flat cable. The wiring conductor is provided in the body, and connects the first external connection conductor and second and third external connection conductors.

公开(公告)号：US20230378651A1

公开(公告)日：2023-11-23

申请号：US18364477

申请日：2023-08-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirotaka FUJII ,  Koji KAMADA ,  Daisuke DOI

IPC: H01Q9/04 ,  H01Q1/38 ,  H01Q1/22

CPC classification number: H01Q9/0414 ,  H01Q1/38 ,  H01Q1/2283

Abstract: An antenna element includes a body including laminated insulator layers, a first ground conductor, and a radiation conductor overlapping the first ground conductor along a first direction from the first ground conductor. Guard ground conductors are provided in the body along the first direction to surround the radiation conductor. The guard ground conductors include second ground conductors electrically interconnected, and one or more first interlayer connection conductors piercing the insulator layers. The second ground conductors are shaped to not make a circuit of the radiation conductor, and are positioned at multiple positions relative to up-down directions. The second ground conductors each have an overlapping portion that overlaps the second ground conductor positioned adjacent to the overlapping portion in an upward or downward direction, and a non-overlapping portion that does not overlap the second ground conductor positioned adjacent to the non-overlapping portion in the upward or downward direction.

公开(公告)号：US20220285082A1

公开(公告)日：2022-09-08

申请号：US17750430

申请日：2022-05-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiminori KOUNO ,  Koji KAMADA

IPC: H01F27/28 ,  H01F27/29 ,  H05K1/02 ,  H05K1/16 ,  H05K3/46

Abstract: A multilayer board includes a first insulator layer including a first coil pattern thereon, a second insulator layer including a second coil pattern thereon, a third insulator layer including a third coil pattern thereon, a first terminal on the first insulator layer and connected to one end of the first coil pattern, a first floating pattern on the first insulator layer and not connected to the first coil pattern, and a second terminal on the third insulator layer and connected to one end of the third coil pattern. The first, second, and third insulator layers are sequentially laminated. The first, second, and third coil patterns are respectively electrically connected in sequence. The first floating pattern overlaps the second coil pattern when viewed from a laminating direction.