公开(公告)号：US11178778B2

公开(公告)日：2021-11-16

申请号：US16728525

申请日：2019-12-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi Nomura ,  Yuta Morimoto ,  Minoru Komiyama ,  Akio Katsube

IPC: H05K9/00 ,  H05K3/42

Abstract: A high frequency module 1a includes a wiring board 2, multiple components 3a to 3d mounted on an upper surface 2a of the wiring board 2, a shield component 4 mounted between the component 3b and the component 3c, a sealing resin layer 5 that covers the components 3a to 3d and the shield component 4, and a shield film 6 that covers the surface of the sealing resin layer. A recess 10 is formed in an upper surface 5a of the sealing resin layer 5 so as to expose the shield component 4. The recess 10 is formed within a region surrounded by edges of the sealing resin layer 5 so as not to reach the side surfaces of the sealing resin layer 5. The shield film 6 further covers wall surfaces 10a of the recess 10 and part of the shield component 4 exposed through the recess 10.

公开(公告)号：US12237273B2

公开(公告)日：2025-02-25

申请号：US17659389

申请日：2022-04-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuo Ishido ,  Motohiko Kusunoki ,  Minoru Komiyama

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/16

Abstract: A module includes a substrate having a first surface, a first component and a second component that are mounted on the first surface, a first conductive material mounted between the first component and the second component, a first sealing resin provided on the first surface to cover the first component, the second component, and the first conductive material, and a first shield film that covers the first sealing resin, in which the first sealing resin has a recess to expose at least a part of the first conductive material, the first shield film extends along an inner surface of the recess and is, thereby, electrically connected to the first conductive material, the first shield film is provided with an opening in the recess, a metal bump is disposed inside the recess, and the metal bump is electrically connected to the first conductive material through the opening.