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公开(公告)号：US20210104350A1
公开(公告)日：2021-04-08
申请号：US17125677
申请日：2020-12-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tatsuya HOSOTANI , Osamu MIKI
Abstract: A planar array coil includes a multilayer substrate at which a plurality of coils are formed and arranged on a plane of the multilayer substrate. First ends of the plurality of coils are connected to switching circuit units of a power conversion circuit, and second ends of the plurality of coils are connected to a common output part. The coils include two coil parts in which currents flow in opposite rotation directions, and one coil part of one coil is adjacent to one coil part of another coil. The plurality of coils are connected such that operation of switching circuits causes currents in regions of adjacent coil parts that extend in parallel to each other to flow in the same direction. Accordingly, adverse effects by unwanted coupling between adjacent coils are reduced and a switching power supply device that includes the planar array coil performs stable power conversion operations.
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公开(公告)号：US20230010809A1
公开(公告)日：2023-01-12
申请号：US17933565
申请日：2022-09-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Norikazu SAKAMOTO , Osamu MIKI , Tatsuya HOSOTANI
Abstract: A multi-converter power supply system includes a plurality of cell converters, a common node to which an individual output terminal of each of the plurality of cell converters is connected, a current waveform signal generation circuit that generates a current waveform signal corresponding to a current waveform flowing through an individual inductor, and a first instrumentation amplifier that receives input of an individual output voltage signal obtained from the individual output terminal and the current waveform signal and that outputs a signal for comparison with a current common signal shared by a plurality of switching control circuits. The current waveform signal and the individual output voltage signal that are input to the first instrumentation amplifier are formed with reference to a potential of the common node.
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公开(公告)号：US20230009649A1
公开(公告)日：2023-01-12
申请号：US17933116
申请日：2022-09-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Osamu MIKI , Tatsuya HOSOTANI
IPC: H05K1/02 , H05K1/14 , H05K7/20 , H01L25/16 , H01L23/367
Abstract: A circuit board module includes a first circuit board having a first main surface on which an electronic component that generates heat when the electronic component operates is mounted and a second main surface, a second circuit board having a third main surface on which the first circuit board is mounted and a fourth main surface, and a first thermally-conductive sheet between the first circuit board and the second circuit board. The first circuit board is mounted such that the second main surface faces the third main surface. The first circuit board includes thermally-conductive vias that extend between the first and second main surfaces, the vias being densely distributed in a region near a mounting terminal of the electronic component, filled with a thermally-conductive member, and physically in contact with the first thermally-conductive sheet that covers the third main surface of the second circuit board.
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公开(公告)号：US20230276573A1
公开(公告)日：2023-08-31
申请号：US18313180
申请日：2023-05-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Osamu MIKI , Tatsuya HOSOTANI
CPC classification number: H05K1/14 , H02M3/003 , H05K1/181 , H05K2201/044
Abstract: A circuit module includes a circuit module substrate having an area smaller than a large-scale circuit board, an electronic circuit component mounted on the circuit module substrate, a connection pin provided to the circuit module substrate, and a circuit-module-substrate-side fitting structure part provided to the circuit module substrate. A pin receptacle and the connection pin are electrically connected to each other. A non-conductive thermal adhesive layer is formed between a surface of the circuit module substrate and a surface of a base material of the large-scale circuit board facing to each other, the non-conductive thermal adhesive layer electrically insulating and thermally joining the surfaces by a non-conductive thermally conductive material.
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Patent Agency Ranking
公开(公告)号：US20210111626A1
公开(公告)日：2021-04-15
申请号：US17129874
申请日：2020-12-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Osamu MIKI , Tatsuya HOSOTANI
Abstract: Power line patterns are, together with a ground pattern, provided separately from control line patterns. The power line pattern is formed at first and second major surfaces of a circuit board. When the circuit board is viewed in plan view, the power line pattern and the power line pattern form a line structure in which the power line pattern and the power line pattern are in parallel with and opposite to each other and the power line pattern is positioned under the power line pattern. The circuit board includes a dielectric between the power line pattern and the power line pattern. These together form an equivalent capacitor and the magnetic flux induced by the current flowing through the power line pattern and the magnetic flux induced by the current flowing through the power line pattern cancel each other out.
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公开(公告)号：US20220094203A1
公开(公告)日：2022-03-24
申请号：US17539958
申请日：2021-12-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyokazu YAMADA , Osamu MIKI , Tatsuya HOSOTANI
Abstract: A power receiver includes an outer case shaped to house a secondary battery, a power reception coil member disposed in the outer case, and a circuit board disposed in the outer case. On the circuit board, a power reception circuit electrically connected to a coil conductor of the power reception coil member and a charging circuit configured to charge and discharge the secondary battery are provided. The outer case includes a first outer case member near the power reception coil member and a second outer case member forming the outer case in combination with the first outer case member. The first outer case member has, for example, a flat surface, is disposed nearer to an external power transmission coil than the second outer case member, and has a structure with which the coil conductor of the power reception coil member and the power transmission coil can face each other.
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公开(公告)号：US20210408835A1
公开(公告)日：2021-12-30
申请号：US17472356
申请日：2021-09-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Osamu MIKI , Tatsuya HOSOTANI
Abstract: A power reception device includes a plurality of power-receiving coils, a plurality of rectifier elements, and a convergent output smoothing capacitor. The plurality of power-receiving coils are positioned in place relative to the housing in such a manner that the plurality of power-receiving coils each include first conductor portions extending along a side surface of the housing. The plurality of rectifier elements are connected respectively to the plurality of power-receiving coils. The convergent output smoothing capacitor stores electric energy output from the plurality of rectifier elements.
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公开(公告)号：US20240206071A1
公开(公告)日：2024-06-20
申请号：US18587254
申请日：2024-02-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tatsuya HOSOTANI , Osamu MIKI
Abstract: A switching power supply device includes a circuit board on which plural inductor windings are formed, and a common magnetic body incorporated into the circuit board from both sides. The circuit board has a common wiring line electrically connected to one end of each of the plural inductor windings in common. The common magnetic body has inner legs inserted through inside the plural inductor windings and an outer leg inserted through outside the plural inductor windings. A smoothing capacitor connected between a common wiring line and ground wiring is mounted on the circuit board to constitute a smoothing filter with the inductance of the common wiring line and the smoothing capacitor. The plural inductor windings are magnetically coupled to each other, and the common wiring line and the plural inductor windings are substantially not magnetically coupled.
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公开(公告)号：US20230124799A1
公开(公告)日：2023-04-20
申请号：US18068459
申请日：2022-12-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Osamu MIKI , Tatsuya HOSOTANI
Abstract: A wireless power transfer system includes a power transmission circuit that includes power transmission resonance mechanisms including power transmission coils and power transmission resonant capacitors, and a power reception circuit that includes a power reception resonance mechanism including a power reception coil that magnetically couples to the power transmission coils and a power reception resonant capacitor. The power transmission circuit includes a square wave power supply circuit including a direct-current power supply and a switching circuit, the power transmission resonance mechanisms and the power reception resonance mechanism form electromagnetic resonance coupling, and the power reception resonance mechanism acquires reception power by superposing resonance currents induced by the electromagnetic resonance coupling.
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