公开(公告)号：US20180114631A1

公开(公告)日：2018-04-26

申请号：US15791457

申请日：2017-10-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koichi IDA ,  Shun OZAKI ,  Hou MURAMOTO ,  Isao IDA

IPC: H01F27/32 ,  H01F27/28 ,  H01F27/255 ,  H01F41/06 ,  H01F41/12

Abstract: An electronic component includes a coil, or a coiled conductor, and a molded body including a sealant containing resin and magnetic powder, and encapsulating the coil. The coil is coated with a cured product of a thermosetting composition, and the coated body is embedded in the molded body. A method of manufacturing the electronic component includes forming a coil by winding a conductor, applying a thermosetting composition on the coil, heat treating the coil on which the composition is applied to obtain a coated body, embedding the coated body into a sealant containing resin and magnetic powder, and applying pressure to the sealant to form a molded body.