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    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20180114631A1

    公开(公告)日：2018-04-26

    申请号：US15791457

    申请日：2017-10-24

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Koichi IDA ,  Shun OZAKI ,  Hou MURAMOTO ,  Isao IDA

    IPC: H01F27/32 ,  H01F27/28 ,  H01F27/255 ,  H01F41/06 ,  H01F41/12

    Abstract: An electronic component includes a coil, or a coiled conductor, and a molded body including a sealant containing resin and magnetic powder, and encapsulating the coil. The coil is coated with a cured product of a thermosetting composition, and the coated body is embedded in the molded body. A method of manufacturing the electronic component includes forming a coil by winding a conductor, applying a thermosetting composition on the coil, heat treating the coil on which the composition is applied to obtain a coated body, embedding the coated body into a sealant containing resin and magnetic powder, and applying pressure to the sealant to form a molded body.

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME
    3.
    发明申请
    ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME 审中-公开

    公开(公告)号：US20190115127A1

    公开(公告)日：2019-04-18

    申请号：US16151121

    申请日：2018-10-03

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Eiji ISO ,  Isao IDA ,  Hiroshi OKUIZUMI ,  Takao KAWACHI

    IPC: H01F1/14 ,  H01F41/04 ,  H01F27/255 ,  H01F27/28 ,  H01F17/00 ,  H01F41/02

    Abstract: A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME
    6.
    发明申请
    ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME 有权

    公开(公告)号：US20230015749A1

    公开(公告)日：2023-01-19

    申请号：US17935412

    申请日：2022-09-26

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Eiji ISO ,  Isao IDA ,  Hiroshi OKUIZUMI ,  Takao KAWACHI

    IPC: H01F1/14 ,  H01F41/04 ,  H01F27/255 ,  H01F27/28 ,  H01F17/00 ,  H01F41/02 ,  H01F17/04 ,  H01F27/29

    Abstract: A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

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