公开(公告)号：US20250089160A1

公开(公告)日：2025-03-13

申请号：US18960290

申请日：2024-11-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： TOMOKI YAMAMOTO ,  Issei YAMAMOTO

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11

Abstract: A multilayer substrate that includes: a first thermoplastic resin layer including a first main surface, a second main surface opposite to the first main surface, and a via hole penetrating from the first main surface to the second main surface; a ceramic layer in contact with the first main surface; an interlayer connection conductor in the via hole; a conductor portion on the ceramic layer and connected to the interlayer connection conductor; an intermetallic compound between the interlayer connection conductor and the conductor portion; and ceramic particles in the intermetallic compound, wherein the ceramic particles include first ceramic particles in contact with both the intermetallic compound and the conductor portion.