公开(公告)号：US20180077829A1

公开(公告)日：2018-03-15

申请号：US15817481

申请日：2017-11-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Issei YAMAMOTO

IPC: H05K9/00 ,  B32B15/08 ,  C23C14/18 ,  H05K5/06 ,  H05K1/18 ,  H05K1/02 ,  H01L23/31 ,  H01L25/065 ,  H01L23/552

Abstract: A high-frequency module includes a wiring board, a component that is mounted on an upper surface of the wiring board, a sealing resin layer that is laminated on the upper surface of the wiring board and that seals the component, a first shield layer that is laminated on the sealing resin layer so as to cover an opposite surface of the sealing resin layer and a peripheral side surface of the sealing resin layer, the opposite surface being opposite to the upper surface of the wiring board, and a second shield layer that is laminated on a portion of the first shield layer that covers the peripheral side surface of the sealing resin layer. In this case, even if the first shield layer cannot be made thick enough for obtaining desired shield characteristics, the second shield layer can provide a thickness corresponding to the insufficient thickness.

公开(公告)号：US20150140201A1

公开(公告)日：2015-05-21

申请号：US14608403

申请日：2015-01-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Jun ADACHI ,  Jun URAKAWA ,  Issei YAMAMOTO

IPC: H05K9/00

CPC classification number: H02H9/04 ,  H01B1/20 ,  H01T4/10 ,  H01T4/12 ,  H01T21/00 ,  H02H9/044 ,  H05K9/0067 ,  H05K9/0069 ,  H05K9/0079 ,  Y10T29/49002

Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity

Abstract translation: 制造ESD保护装置，使其ESD特性容易调节和稳定。 ESD保护装置包括绝缘基板，设置在绝缘基板中的空腔，至少一对放电电极，每一对放电电极各自包括暴露在空腔中的部分，暴露部分彼此相对布置，外部电极设置在表面上 并连接到所述至少一对放电电极。 具有导电性的颗粒状支撑电极材料分散在空腔中的至少一对放电电极的露出部分之间

公开(公告)号：US20250087568A1

公开(公告)日：2025-03-13

申请号：US18960244

申请日：2024-11-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Issei YAMAMOTO ,  Tomoki YAMAMOTO

IPC: H01L23/498

Abstract: A multilayer substrate that includes: a first thermoplastic resin layer including a first main surface, a second main surface opposite to the first main surface, and a via hole penetrating from the first main surface to the second main surface; a ceramic layer in contact with the first main surface; a second thermoplastic resin layer in contact with the second main surface; a first electrode on a surface of the ceramic layer in contact with the first main surface; a protective layer covering at least part of an outline of the first electrode; a second electrode on a surface of the second thermoplastic resin layer in contact with the second main surface; an interlayer connection conductor in the via hole and connecting the first electrode and the second electrode; and an intermetallic compound between the interlayer connection conductor and the first electrode.

公开(公告)号：US20230413439A1

公开(公告)日：2023-12-21

申请号：US18459949

申请日：2023-09-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Issei YAMAMOTO

IPC: H05K1/14 ,  H05K3/46 ,  H05K1/18 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K1/14 ,  H05K3/4611 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K1/0296 ,  H05K1/183 ,  H05K1/028 ,  H05K2201/041

Abstract: Wiring board includes rigid board and flexible board laminated on rigid board. Cavity recessed in thickness direction of rigid board is formed in surface of rigid board which is located on flexible board side. Side surface and bottom surface of cavity are formed of rigid board. Top surface of cavity is formed of flexible board.

公开(公告)号：US20230113966A1

公开(公告)日：2023-04-13

申请号：US18064968

申请日：2022-12-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toru YASO ,  Masahiro TERAMOTO ,  Naoya MURAKITA ,  Issei YAMAMOTO

IPC: H01L23/15 ,  H01L23/498 ,  H05K3/00 ,  H05K3/46 ,  H01L23/13 ,  H05K3/40 ,  H05K3/12

Abstract: An electronic component including: an electronic component body; at least one electrode on a surface of the electronic component body; and a cover layer having insulating properties on at least a part of a periphery of the electrode and extending across a boundary between the periphery of the electrode and the surface of the electronic component body, wherein the electrode includes, on the at least part of the periphery, a lower electrode closer to the surface of the electronic component body and an upper electrode on the lower electrode, the lower electrode extends more outward than the upper electrode to create a step at the at least part of the periphery of the electrode, and at the step at the periphery of the electrode, the cover layer extends from a surface of the upper electrode to a portion with no electrodes on the surface of the electronic component body.

公开(公告)号：US20200266549A1

公开(公告)日：2020-08-20

申请号：US16867140

申请日：2020-05-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Issei YAMAMOTO

IPC: H01Q21/06 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q9/04

Abstract: An antenna-mounted substrate includes a first patch antenna, a second patch antenna disposed to face one principal surface of the first patch antenna, and a ground electrode disposed to face the other principal surface of the first patch antenna, the antenna-mounted substrate further including an antenna holding layer holding the second patch antenna, an inter-antenna layer positioned between the first patch antenna and the second patch antenna, and a substrate layer positioned between the first patch antenna and the ground electrode, those three layers being positioned in the mentioned order, wherein the inter-antenna layer is made of a dielectric material, and a relation of εr3>εr1≥εr2 is satisfied on an assumption that a relative permittivity of the antenna holding layer is denoted by εr1, a relative permittivity of the inter-antenna layer is denoted by εr2, and a relative permittivity of the substrate layer is denoted by εr3.

公开(公告)号：US20190341329A1

公开(公告)日：2019-11-07

申请号：US16508788

申请日：2019-07-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Issei YAMAMOTO ,  Tadashi NOMURA

IPC: H01L23/367 ,  H01L23/498 ,  H01L25/16 ,  H01L23/31 ,  H01L23/552

Abstract: A module improves a heat-releasing effect and that can be stably mounted on a mother substrate or the like. The module includes: a first component mounted on one main surface of a wiring substrate and generates heat; second components mounted on the one main surface of the wiring substrate; a sealing resin layer that seals the first component and the second components so as not to cover a top surface of the first component; and heat-dissipating parts arranged on the top surface of the first component. The height of the highest positions of the heat-dissipating parts relative to the one main surface is less than or equal to the position of a highest surface out of a surface of the sealing resin layer that is on the opposite side from the surface of the sealing resin layer that faces the one main surface.

公开(公告)号：US20250089160A1

公开(公告)日：2025-03-13

申请号：US18960290

申请日：2024-11-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： TOMOKI YAMAMOTO ,  Issei YAMAMOTO

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11

Abstract: A multilayer substrate that includes: a first thermoplastic resin layer including a first main surface, a second main surface opposite to the first main surface, and a via hole penetrating from the first main surface to the second main surface; a ceramic layer in contact with the first main surface; an interlayer connection conductor in the via hole; a conductor portion on the ceramic layer and connected to the interlayer connection conductor; an intermetallic compound between the interlayer connection conductor and the conductor portion; and ceramic particles in the intermetallic compound, wherein the ceramic particles include first ceramic particles in contact with both the intermetallic compound and the conductor portion.

公开(公告)号：US20230371182A1

公开(公告)日：2023-11-16

申请号：US18359074

申请日：2023-07-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiki TOBITA ,  Issei YAMAMOTO

IPC: H05K1/16 ,  H01L23/498 ,  H05K1/18 ,  H01F27/28 ,  H05K1/11

CPC classification number: H05K1/165 ,  H01L23/49838 ,  H05K1/181 ,  H01F27/2804 ,  H05K1/111 ,  H05K2201/10166 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10234 ,  H05K2201/10522 ,  H01L24/16

Abstract: To provide wiring board capable of reducing influence of variation in size of conductive member on coil conductor. Wiring board according to present disclosure includes insulating layer, plurality of land electrodes formed on lower surface of insulating layer, solder ball formed on surface of at least one of plurality of land electrodes, and coil conductor provided inside insulating layer and having winding axis intersecting lower surface. Plurality of land electrodes includes electrode at a position overlapped opening of coil conductor in plan view seen at the wiring board from lower surface side, and second electrode at a position deviated from opening of coil conductor in plan view. Area of first electrode is larger than area of second electrode in plan view.

公开(公告)号：US20200303813A1

公开(公告)日：2020-09-24

申请号：US16896378

申请日：2020-06-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuta MORIMOTO ,  Issei YAMAMOTO

IPC: H01Q1/40

Abstract: An antenna-attached substrate according to the present disclosure includes a substrate layer, a lower antenna element that is disposed in the substrate layer, an antenna-holding layer that is stacked on an upper surface of the substrate layer, and an upper antenna element that is disposed in the antenna-holding layer and that faces an upper surface of the lower antenna element. The antenna-holding layer is composed of a dielectric material having a relative dielectric constant lower than that of the substrate layer. A lower surface, a side surface, and an upper surface of the upper antenna element are covered by the antenna-holding layer.