公开(公告)号：US20230328939A1

公开(公告)日：2023-10-12

申请号：US18333677

申请日：2023-06-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki OSHIMA

IPC: H05K9/00 ,  H05K1/18

CPC classification number: H05K9/0026 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10098

Abstract: A radio frequency module includes a substrate having a first major surface and a second major surface that face each other, a first component disposed on or over the first major surface of the substrate, a second component disposed on the first component, a third component disposed on or over the first major surface of the substrate, and a metallic body connected to a ground. One end of the metallic body is connected to the first major surface of the substrate; and in plan view, the metallic body is disposed between the first component and the third component.

公开(公告)号：US20220369453A1

公开(公告)日：2022-11-17

申请号：US17815987

申请日：2022-07-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki OSHIMA

IPC: H05K1/02

Abstract: There is provided a radio-frequency module and a communication device with which miniaturization can be achieved and quality deterioration can be suppressed. A radio-frequency module includes a mount board on which a ground terminal is disposed, a first chip, a second chip, and a cover (a shield cover). The first chip is disposed on the mount board. The second chip is disposed on the first chip. The cover covers at least a part of the first chip and at least a part of the second chip. The second chip has a first connection terminal (a ground terminal) on an opposite side from the first chip in a thickness direction of the mount board. The cover includes a shield layer connected to the ground terminal disposed on the mount board. The first connection terminal is connected to the shield layer

公开(公告)号：US20220173759A1

公开(公告)日：2022-06-02

申请号：US17651478

申请日：2022-02-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Isao TAKENAKA ,  Shogo YANASE ,  Takayuki OSHIMA

IPC: H04B1/38 ,  H04B1/12 ,  H04B1/03 ,  H04B1/04

Abstract: To provide a radio frequency module and a communication device capable of achieving reduction in height. The radio frequency module includes a mounting substrate and one or more chip inductors. The mounting substrate has a recess at least one end of both ends in a second direction orthogonal to a first direction that is a thickness direction of the mounting substrate. A second chip inductor that is at least one chip inductor of the one or more chip inductors is disposed in the recess.