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公开(公告)号：US20230188169A1
公开(公告)日：2023-06-15
申请号：US18165951
申请日：2023-02-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoichi SAWADA , Takayuki SHINOZAKI
IPC: H04B1/04
CPC classification number: H04B1/04 , H04B2001/0416
Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.
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公开(公告)号：US20220094308A1
公开(公告)日：2022-03-24
申请号：US17540264
申请日：2021-12-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takayuki SHINOZAKI , Shigeru TSUCHIDA
Abstract: A radio-frequency module includes a mounting substrate, a power amplifier, and a controller. The mounting substrate has first and second main surfaces opposing each other. The power amplifier is disposed on one of the first and second main surfaces (the first main surface, for example) of the mounting substrate. The controller is disposed on the other one of the first and second main surfaces (the second main surface, for example) of the mounting substrate. The controller controls the power amplifier.
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公开(公告)号：US20210306018A1
公开(公告)日：2021-09-30
申请号：US17210523
申请日：2021-03-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Naoya MATSUMOTO , Takayuki SHINOZAKI
Abstract: A radio frequency module includes: a module board; a first semiconductor device containing a first power amplifier and a second power amplifier; and a second semiconductor device containing a first switch, the first switch including a first terminal connected to the first power amplifier and a second terminal connected to the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board.
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公开(公告)号：US20210091800A1
公开(公告)日：2021-03-25
申请号：US17008673
申请日：2020-09-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoichi SAWADA , Takayuki SHINOZAKI , Yukiya YAMAGUCHI
Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission power amplifier configured to amplify a transmission signal; a first switch; and a first inductor included in a matching circuit connected between an output terminal of the transmission power amplifier and the first switch. The first inductor is disposed on the first principal surface, and the first switch is disposed on the second principal surface.
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公开(公告)号：US20240372571A1
公开(公告)日：2024-11-07
申请号：US18773653
申请日：2024-07-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takayuki SHINOZAKI
Abstract: A high-frequency module includes an antenna terminal and an input terminal. A second switch is connected between the antenna terminal and the input terminal, and a power amplifier is connected between the second switch and the input terminal. A mounting substrate has a first main surface and a second main surface on opposite sides of the mounting surface. The power amplifier includes a driver stage amplifier and an output stage amplifier. The driver stage amplifier and the second switch are arranged on the second main surface of the mounting substrate, and the output stage amplifier is arranged on the first main surface of the mounting substrate. The driver stage amplifier and the second switch are included in one semiconductor chip.
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Patent Agency Ranking
公开(公告)号：US20220190849A1
公开(公告)日：2022-06-16
申请号：US17685390
申请日：2022-03-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takayuki SHINOZAKI
Abstract: To achieve miniaturization, a high-frequency module includes a mounting substrate, a power amplifier, and an electronic component. The mounting substrate has a first main surface and a second main surface on opposite sides. The power amplifier is arranged on a mounting substrate. The power amplifier has a driver stage amplifier and an output stage amplifier. The driver stage amplifier is arranged on the second main surface of the mounting substrate. The output stage amplifier is arranged on the first main surface of the mounting substrate. The electronic component is arranged on the first main surface of the mounting substrate. The electronic component overlaps the driver stage amplifier in a plan view from a thickness direction of the mounting substrate.
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公开(公告)号：US20210092213A1
公开(公告)日：2021-03-25
申请号：US17020812
申请日：2020-09-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takayuki SHINOZAKI , Yoichi SAWADA
Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission input terminal, an antenna connection terminal, and a transmission power amplifier. At least one of one or more first circuit components that are disposed on a transmission input path connecting the transmission input terminal and the transmission power amplifier is mounted on the first principal surface, and at least one of one or more second circuit components that are disposed on a first transmission output path or a second transmission output path each connecting an output terminal of the transmission power amplifier and the antenna connection terminal is mounted on the second principal surface.
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公开(公告)号：US20210091801A1
公开(公告)日：2021-03-25
申请号：US17016390
申请日：2020-09-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takayuki SHINOZAKI , Yukiya YAMAGUCHI , Morio TAKEUCHI , Yoichi SAWADA
Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof, a transmission power amplifier, a control circuit that controls the transmission power amplifier, and a first inductor connected to an output terminal of the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first inductor is disposed on the second principal surface.
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公开(公告)号：US20210091797A1
公开(公告)日：2021-03-25
申请号：US17022139
申请日：2020-09-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takayuki SHINOZAKI
Abstract: A radio frequency module is capable of at least one of simultaneously transmitting, simultaneously receiving, or simultaneously transmitting and receiving a radio frequency signal of a first communication band and a radio frequency signal of a second communication band. The radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a first duplexer having, as pass bands, a transmission band and a reception band of the first communication band; and a second duplexer having, as pass bands, a transmission band and a reception band of the second communication band. The first duplexer is disposed on the first principal surface and the second duplexer is disposed on the second principal surface.
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公开(公告)号：US20220255571A1
公开(公告)日：2022-08-11
申请号：US17727806
申请日：2022-04-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoichi SAWADA , Takayuki SHINOZAKI
IPC: H04B1/04
Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.
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