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公开(公告)号：US20230179235A1
公开(公告)日：2023-06-08
申请号：US18162834
申请日：2023-02-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA , Naoya MATSUMOTO
CPC classification number: H04B1/0067 , H04B1/40 , H04B1/1018
Abstract: A radio frequency module includes: a module substrate having a main surface; a conductive member to partition the main surface into regions in a plan view of the main surface, and being set to ground electric potential; a switch disposed in one of the regions and connected to an antenna connection terminal; a power amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch; and a low-noise amplifier disposed in one of the regions and connected to the antenna connection terminal via the switch.
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公开(公告)号：US20210306017A1
公开(公告)日：2021-09-30
申请号：US17210506
申请日：2021-03-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Naoya MATSUMOTO , Takayuki SHINOZAKI
Abstract: A radio frequency module includes: a module board; a first semiconductor device containing a first power amplifier and a second power amplifier, the first power amplifier being configured to amplify a radio frequency signal of a first communication band, the second power amplifier being configured to amplify a radio frequency signal of a second communication band, the second communication band being different from the first communication band; and a second semiconductor device containing a control circuit configured to control the first power amplifier and the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board.
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公开(公告)号：US20200251459A1
公开(公告)日：2020-08-06
申请号：US16780087
申请日：2020-02-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Motoji TSUDA , Takanori UEJIMA , Yuji TAKEMATSU , Katsunari NAKAZAWA , Masahide TAKEBE , Shou MATSUMOTO , Naoya MATSUMOTO , Yutaka SASAKI , Yuuki FUKUDA
IPC: H01L25/16 , H01L23/00 , H01Q1/02 , H01L23/31 , H01L23/498 , H01L23/66 , H01Q1/24 , H01L23/552
Abstract: A high-frequency module includes a mounting substrate having main surfaces 30a and 30b, a first circuit component mounted on the main surface 30a, a second circuit component mounted on the main surface 30b, an external connection terminal arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.
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公开(公告)号：US20190319618A1
公开(公告)日：2019-10-17
申请号：US16453052
申请日：2019-06-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Naoya MATSUMOTO
IPC: H03K17/693
Abstract: A high frequency switch (1) includes a first input/output terminal (30); at least three second input/output terminals (40a to 40e); a first switch (10) including a first common terminal (11) and at least two first selection terminals (12a to 12c) selectively connected to the first common terminal (11); and a second switch (20) including a second common terminal (21) connected to the first selection terminal (12c) with a matching circuit (50) interposed therebetween and at least two second selection terminals (22a to 22c) selectively connected to the second common terminal (21), in which the first common terminal (11) is connected to the first input/output terminal (30), the first selection terminals (12a and 12b) are connected to the second input/output terminals (40a and 40b), and the second selection terminals (22a to 22c) are connected to the second input/output terminals (40c to 40e).
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公开(公告)号：US20240105628A1
公开(公告)日：2024-03-28
申请号：US18496304
申请日：2023-10-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA , Naoya MATSUMOTO
IPC: H01L23/538 , H01L23/31 , H01L23/498 , H01L23/552 , H01L25/16
CPC classification number: H01L23/5383 , H01L23/3121 , H01L23/49811 , H01L23/5385 , H01L23/5386 , H01L23/552 , H01L25/16 , H01L24/16 , H01L2224/16225
Abstract: A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a connection terminal, and a wiring layer. The second electronic component is disposed on the second main surface of the mounting substrate. The connection terminal is disposed on the second main surface of the mounting substrate and is connected to the mounting substrate and the wiring layer. The wiring layer faces the second main surface of the mounting substrate with the second electronic component interposed therebetween and is in contact with the connection terminal. The wiring layer has a base material and an external connection electrode. The base material has a second conductive member connected to the first conductive member of the mounting substrate with the connection terminal interposed therebetween. The external connection electrode is connected to the second conductive member. The wiring layer is in contact with the second electronic component.
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Patent Agency Ranking
公开(公告)号：US20230262879A1
公开(公告)日：2023-08-17
申请号：US18299767
申请日：2023-04-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Masateru HIGASHI , Shogo YANASE , Masaki KIMURA , Masanari MIURA , Naoya MATSUMOTO , Takahiro KATAMATA , Takanori UEJIMA
CPC classification number: H05K1/0243 , H05K1/0218 , H04B1/40 , H05K2201/1006
Abstract: A first filter is prevented from being affected by the coplanarity of a mounting substrate and a degradation of the filter characteristics of the first filter is reduced. A first filter, a second filter, a third filter, and a first switch are mounted on a first principal surface of a mounting substrate. The first filter passes a first high-frequency signal and a second high-frequency signal, the second filter passes a third high-frequency signal, and the third filter passes a fourth high-frequency signal. The first switch is capable of simultaneously connecting the first filter and the second filter to an antenna terminal. In a plan view from a thickness direction of the mounting substrate, the first filter is larger than the second filter and the third filter and located between the second filter and the third filter. A first wire and a second wire are each shorter than a third wire.
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公开(公告)号：US20210320677A1
公开(公告)日：2021-10-14
申请号：US17221849
申请日：2021-04-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Naoya MATSUMOTO
Abstract: A radio frequency module including a module substrate including a first principal surface and a second principal surface; a power amplifier; an inductor disposed on the second principal surface and connected to the power amplifier; and an external connection terminal configured to receive a power supply voltage. The first external connection terminal is disposed on the second principal surface and connected to the power amplifier via the inductor.
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公开(公告)号：US20210306018A1
公开(公告)日：2021-09-30
申请号：US17210523
申请日：2021-03-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Naoya MATSUMOTO , Takayuki SHINOZAKI
Abstract: A radio frequency module includes: a module board; a first semiconductor device containing a first power amplifier and a second power amplifier; and a second semiconductor device containing a first switch, the first switch including a first terminal connected to the first power amplifier and a second terminal connected to the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board.
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公开(公告)号：US20230198556A1
公开(公告)日：2023-06-22
申请号：US18168682
申请日：2023-02-14
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori UEJIMA , Hiromichi KITAJIMA , Naoya MATSUMOTO , Hisanori MURASE , Nanami YUMURA , Yoichi SAWADA
CPC classification number: H04B1/03 , H04B1/18 , H04B1/04 , H04B2001/0408
Abstract: A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; a resin component that covers the first circuit component and the second circuit component; a metal shield layer that covers a surface of the resin component; a metal shield plate that is disposed over the major face and, with the module substrate seen in plan view, located between the first circuit component and the second circuit component; and a via-conductor disposed in the module substrate and set to a ground potential. The metal shield plate is in contact with the metal shield layer, and connected at the major face with the via-conductor. The metal shield plate has a thickness greater than a thickness of the metal shield layer and less than or equal to an outside diameter (of the via-conductor.
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公开(公告)号：US20210409062A1
公开(公告)日：2021-12-30
申请号：US17225131
申请日：2021-04-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Naoya MATSUMOTO
Abstract: A radio-frequency module includes a module substrate, a power amplifier, and a control circuit configured to control the power amplifier. The control circuit includes a temperature sensor. The power amplifier and the control circuit are stacked one on top of another on a principal surface of the module substrate.
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