公开(公告)号：US20230282569A1

公开(公告)日：2023-09-07

申请号：US18131385

申请日：2023-04-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takami MUTO ,  Tsutomu ISHIGE ,  Takanari OKADA ,  Hiroki MINAMI ,  Munetake MIYASHITA

IPC: H01L23/522 ,  H01L23/00 ,  H02M3/158

CPC classification number: H01L23/5223 ,  H01L23/5227 ,  H01L24/13 ,  H02M3/158 ,  H01L2924/19042 ,  H01L2924/19041 ,  H01L2924/1426 ,  H01L2924/1306

Abstract: A power supply circuit module includes a power supply circuit including a lower substrate, an upper substrate parallel or substantially parallel to the lower substrate, an inductor, and chip components mounted on the lower substrate, switching circuit components and chip components mounted on the upper substrate, and substrate connectors that connect the lower substrate with the upper substrate electrically and mechanically. A portion of the substrate connectors is an inductor configuring portion of the power supply circuit or a portion of an inductor configuring portion of the power supply circuit.

公开(公告)号：US20210020352A1

公开(公告)日：2021-01-21

申请号：US17031993

申请日：2020-09-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tomoki OKANO ,  Keisuke TERANISHI ,  Tsutomu ISHIGE

IPC: H01F27/28 ,  H01F27/24 ,  H01F41/02 ,  H01F41/04

Abstract: An inductor element includes a magnetic body core provided with a through-hole, and a coil inserted through the through-hole and wound around the magnetic body core a plurality of times. The coil includes three bonding portions located on one side in a thickness direction of the magnetic body core. The three bonding portions are located on a first virtual plane that partially intersects with the coil.