公开(公告)号：US20190189334A1

公开(公告)日：2019-06-20

申请号：US16269587

申请日：2019-02-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Munetake MIYASHITA ,  Takayuki TANGE ,  Hideaki HASHI

IPC: H01F27/28 ,  H05K1/18 ,  H01F27/24 ,  H01F27/29 ,  H02M7/00

CPC classification number: H01F27/2804 ,  H01F17/00 ,  H01F17/04 ,  H01F27/24 ,  H01F27/29 ,  H01F37/00 ,  H01F2027/2809 ,  H02M3/155 ,  H02M3/28 ,  H02M3/335 ,  H02M7/003 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10053

Abstract: An inductor component includes cores, a coil disposed in the cores, and terminal electrodes. The coil includes first metal plates disposed on an upper surface of the cores, second metal plates disposed on a lower surface of the cores, and a plurality of metal pins each passing through one of the cores in a thickness direction. The coil has a helical shape by connecting the first metal plates to the second metal plates, with the plurality of metal pins therebetween. The terminal electrodes are spaced apart along a direction in which the helical shape extends, and are connected to the coil.

公开(公告)号：US20180330870A1

公开(公告)日：2018-11-15

申请号：US16046092

申请日：2018-07-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio SAKAI ,  Yoshihito OTSUBO ,  Hideaki HASHI ,  Takayuki TANGE ,  Munetake MIYASHITA ,  Takeshi WAKE ,  Yasuhiro HIGASHIDE

IPC: H01F27/29 ,  H05K1/18 ,  H01F27/24 ,  H01F41/02 ,  H01F27/32 ,  H05K1/11

CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F17/04 ,  H01F27/022 ,  H01F27/24 ,  H01F27/2847 ,  H01F27/2852 ,  H01F27/327 ,  H01F41/02 ,  H01F41/043 ,  H01F41/10 ,  H01F2017/002 ,  H05K1/115 ,  H05K1/185 ,  H05K3/284 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/1028 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2203/1316

Abstract: An inductor component 1a includes a resin layer 3 and an inductor electrode 6. The inductor electrode 6 includes metal pins 7a to 7d that extend in the resin layer 3 with upper end surfaces thereof exposed from the upper surface 3a of the resin layer 3, and upper wiring plates 8a and 8b that are disposed on the upper surface 3a of the resin layer 3 and that connect upper end surfaces of the short metal pins 7a and 7c and upper end surfaces of the long metal pins 7b and 7d to each other. In this case, the inductor electrode 6 is formed of the metal pins 7a to 7d and wiring plates 8a to 8c that each have a specific electrical resistance lower than that of a conductive paste and plating, and the resistance of the entire inductor electrode 6 can be decreased.

公开(公告)号：US20250038157A1

公开(公告)日：2025-01-30

申请号：US18716188

申请日：2023-02-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takami MUTO ,  Hiroki MINAMI ,  Munetake MIYASHITA ,  Masanari TAGO

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538

Abstract: A power supply module includes a first substrate; a control IC, a capacitor, a first electronic component, a second electronic component, a third electronic component and a fourth electronic component on a principal surface of the first substrate; a first submodule including a second substrate above the first electronic component, the second electronic component, the third electronic component, and the fourth electronic component and including a fifth electronic component, a sixth electronic component, and a seventh electronic component on a principal surface of the second substrate; and a resin covering an upper portion of the first submodule.

公开(公告)号：US20190295761A1

公开(公告)日：2019-09-26

申请号：US16438516

申请日：2019-06-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Munetake MIYASHITA ,  Yuji TAMURA ,  Takayuki TANGE ,  Hideaki HASHI ,  Takeshi WAKE ,  Yasuhiro HIGASHIDE

IPC: H01F27/245 ,  H01F17/04 ,  H01F27/28 ,  H01F41/02 ,  H01F27/29 ,  H02M3/155

Abstract: An inductor includes a first terminal and a second terminal, a first inductor conductor layer and a second inductor conductor layer, a magnetic core layer, and via conductors. The magnetic core layer is disposed between the first and second inductor conductor layers. The via conductors are connected to the first and second inductor conductor layers. The first and second terminals are electrically connected through the via conductors. The magnetic core layer includes a first magnetic substance portion including a first magnetic substance, and a second magnetic substance portion including a second magnetic substance. Magnetic properties of the second magnetic substance are different from magnetic properties of the first magnetic substance.

公开(公告)号：US20230282569A1

公开(公告)日：2023-09-07

申请号：US18131385

申请日：2023-04-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takami MUTO ,  Tsutomu ISHIGE ,  Takanari OKADA ,  Hiroki MINAMI ,  Munetake MIYASHITA

IPC: H01L23/522 ,  H01L23/00 ,  H02M3/158

CPC classification number: H01L23/5223 ,  H01L23/5227 ,  H01L24/13 ,  H02M3/158 ,  H01L2924/19042 ,  H01L2924/19041 ,  H01L2924/1426 ,  H01L2924/1306

Abstract: A power supply circuit module includes a power supply circuit including a lower substrate, an upper substrate parallel or substantially parallel to the lower substrate, an inductor, and chip components mounted on the lower substrate, switching circuit components and chip components mounted on the upper substrate, and substrate connectors that connect the lower substrate with the upper substrate electrically and mechanically. A portion of the substrate connectors is an inductor configuring portion of the power supply circuit or a portion of an inductor configuring portion of the power supply circuit.

公开(公告)号：US20190037700A1

公开(公告)日：2019-01-31

申请号：US16143509

申请日：2018-09-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki TANGE ,  Yasuhiro HIGASHIDE ,  Takeshi WAKE ,  Munetake MIYASHITA

IPC: H05K1/18 ,  H02M3/158 ,  H05K1/11

Abstract: A power supply module includes first and second outer surfaces that are adjacent to and perpendicular or substantially perpendicular to each other. The power supply module includes a substrate that includes a first surface and a side surface, electronic components mounted at least on the first surface, a first resin material provided on the first surface, and terminal electrodes exposed at least at the first outer surface. The first resin member seals the electronic components mounted on the first surface. In the substrate, the first surface is perpendicular or substantially perpendicular to the first outer surface, which extends at least across the side surface of the substrate and the first resin member. The area of the first outer surface is smaller than the area of the second outer surface.