公开(公告)号：US20210012951A1

公开(公告)日：2021-01-14

申请号：US16924668

申请日：2020-07-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Lee FRANCIS ,  William JARVIS ,  Takayuki TANGE

IPC: H01F27/28 ,  H01F27/255 ,  H01F27/42 ,  H01F17/06

Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, a lead frame that supports the core and that electrically connects the winding to the substrate, and an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.

公开(公告)号：US20250046510A1

公开(公告)日：2025-02-06

申请号：US18926765

申请日：2024-10-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Lee FRANCIS ,  William JARVIS ,  Takayuki TANGE

IPC: H01F27/28 ,  H01F27/02 ,  H01F27/24 ,  H01F41/02 ,  H01F41/04 ,  H01F41/064 ,  H01F41/12 ,  H02P27/08

Abstract: A magnetic-component module includes a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate; and an overmold material encapsulating the core, the spacer, and the wire bonds.

公开(公告)号：US20210012950A1

公开(公告)日：2021-01-14

申请号：US16924240

申请日：2020-07-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Lee FRANCIS ,  William JARVIS ,  Takayuki TANGE

IPC: H01F27/28 ,  H01F27/24 ,  H01F27/02 ,  H01F41/02 ,  H01F41/04 ,  H01F41/064 ,  H01F41/12

Abstract: A magnetic-component module includes a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate; and an overmold material encapsulating the core, the spacer, and the wire bonds.

公开(公告)号：US20240274346A1

公开(公告)日：2024-08-15

申请号：US18626583

申请日：2024-04-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Lee FRANCIS ,  William JARVIS ,  Takayuki TANGE

IPC: H01F27/28 ,  H01F17/06 ,  H01F27/255 ,  H01F27/42

CPC classification number: H01F27/2828 ,  H01F17/062 ,  H01F27/255 ,  H01F27/425

Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, a lead frame that supports the core and that electrically connects the winding to the substrate, and an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.

公开(公告)号：US20240249874A1

公开(公告)日：2024-07-25

申请号：US18626578

申请日：2024-04-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Lee FRANCIS ,  William JARVIS ,  Takayuki TANGE ,  Shouhei HIROSE

IPC: H01F27/28 ,  H01F17/06 ,  H01F27/255

CPC classification number: H01F27/2895 ,  H01F17/062 ,  H01F27/255 ,  H01F27/2828

Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.

公开(公告)号：US20210012952A1

公开(公告)日：2021-01-14

申请号：US16924666

申请日：2020-07-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Lee FRANCIS ,  William JARVIS ,  Takayuki TANGE ,  Shouhei HIROSE

IPC: H01F27/28 ,  H01F27/255 ,  H01F17/06

Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.