ISOLATED GATE DRIVER SYSTEM
    1.
    发明申请

    公开(公告)号:US20250007394A1

    公开(公告)日:2025-01-02

    申请号:US18758175

    申请日:2024-06-28

    Inventor: Takayuki TANGE

    Abstract: In an isolated gate driver system, isolation for both power transmission and signal transmission is integrated into a single module. The isolated gate driver system includes a resonant isolated DC-DC converter, and uses a modulation scheme to transfer a control signal in combination with power supply through a transformer of the resonant isolated DC-DC converter. A resonance tank control switch modifies a capacitance in a resonance tank circuit based on a signal indicative of the control signal.

    EMBEDDED MAGNETIC DEVICE INCLUDING MULTILAYER WINDINGS

    公开(公告)号:US20230335335A1

    公开(公告)日:2023-10-19

    申请号:US18027224

    申请日:2021-09-29

    Inventor: Takayuki TANGE

    CPC classification number: H01F41/046 H01F27/2804 H01F27/2895 H01F2027/2809

    Abstract: A device includes a substrate; a magnetic core in the substrate and including a hole; a first winding extending through the hole and around the magnetic core; a second winding extending through the hole, around the magnetic core, and around a portion of the first winding; a first covering located on a first surface of the substrate and over a first portion of the second winding; and a second covering located on a second surface of the substrate and over a second portion of the second winding. The first and the second windings only extend around the same half of the magnetic core.

    SURFACE-MOUNTED MAGNETIC-COMPONENT MODULE

    公开(公告)号:US20210012952A1

    公开(公告)日:2021-01-14

    申请号:US16924666

    申请日:2020-07-09

    Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.

    SELECTABLE THREE-LEVEL, HALF-BRIDGE CIRCUIT
    10.
    发明公开

    公开(公告)号:US20230170810A1

    公开(公告)日:2023-06-01

    申请号:US17919328

    申请日:2021-03-22

    Inventor: Takayuki TANGE

    CPC classification number: H02M3/33571 H02M1/143 H02M3/3353 H02M1/0095

    Abstract: A DC-DC conversion circuit includes an input voltage; a half-bridge circuit connected to the input voltage and including a first leg with first, second, third, and fourth switching elements connected in series and including a second leg with first and second capacitors connected in series with each other and connected in parallel with the first leg; and a flying capacitor connected to a node between the first switching element and the second switching element and a node between the third switching element and the fourth switching element; a transformer including a primary winding connected to the half-bridge circuit; and a controller that controls the first to fourth switching elements. The controller selectively controls the half-bridge circuit in a half-bridge operation in which ±Vin/2 is applied to the primary winding, where Vin is the input voltage and a 3-level half-bridge operation in which ±Vin/4 is applied to the primary winding.

Patent Agency Ranking