公开(公告)号：US11757476B2

公开(公告)日：2023-09-12

申请号：US18157265

申请日：2023-01-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masakazu Hirobe ,  Takanori Uejima ,  Yoshihiro Daimon ,  Nanami Yumura

IPC: H04B1/00 ,  H04B1/16

CPC classification number: H04B1/0078 ,  H04B1/1615

Abstract: A radio frequency module includes a transmit filter that allows a transmit signal of a band A for FDD to pass through, a receive filter that allows a receive signal of the band A to pass through, a filter that allows a transmit/receive signal of a band B for TDD to pass through, power amplifiers, a low noise amplifier, a switch between connecting the receive filter to the low noise amplifier and connecting the filter to the low noise amplifier, a switch between connecting the filter to the power amplifier and connecting the filter to the low noise amplifier, a matching circuit connected between the power amplifier and the transmit filter, a matching circuit connected between the power amplifier and the switch, and a module board. On the module board, each of the power amplifiers and the switch is arranged in between the matching circuit and the matching circuit.

公开(公告)号：US11418158B2

公开(公告)日：2022-08-16

申请号：US16837601

申请日：2020-04-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihiro Daimon ,  Kenji Tahara

IPC: H03F3/191 ,  H03F3/24 ,  H03F3/195 ,  H03F3/21 ,  H04B1/04 ,  H03F1/56

Abstract: A first power amplifier amplifies first transmission signals in a first frequency band and outputs the resultant signals. A first matching circuit includes a plurality of first inductor portions and is connected to an output pad electrode of the first power amplifier. A second power amplifier amplifies second transmission signals in a second frequency band higher than the first frequency band and outputs the resultant signals. A second matching circuit includes at least one second inductor portion and is connected to an output side of the second power amplifier. A multilayer substrate has a first main surface and a second main surface located opposite to each other and is provided with the first and second power amplifiers and the first and second matching circuits. The first inductor portion closer than the other first inductor portions to the output pad electrode includes an inner-layer inductor portion located in the multilayer substrate.

公开(公告)号：US11411586B2

公开(公告)日：2022-08-09

申请号：US17189291

申请日：2021-03-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hidetaka Takahashi ,  Satoshi Goto ,  Yoshiki Yasutomo ,  Daerok Oh ,  Yuuto Aoki ,  Yoshihiro Daimon ,  Naoya Matsumoto

IPC: H04B1/04 ,  H04B1/40 ,  H03F3/19 ,  H04B1/00 ,  H05K3/46

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.