公开(公告)号：US11056808B2

公开(公告)日：2021-07-06

申请号：US16266156

申请日：2019-02-04

申请人： Murata Manufacturing Co., Ltd.

发明人： Jun Sasaki ,  Yoichi Saito ,  Takahiro Baba ,  Fumie Matsuda ,  Yoshitomo Tanaka

IPC分类号： H01P3/08 ,  H01R12/71 ,  H05K3/32 ,  H05K3/46 ,  H05K3/28 ,  H05K1/02 ,  H01P11/00

摘要： A module includes a multilayer body that includes insulating-resin base members laminated together, first and second main surfaces, and first and second regions when viewed in plan view. A first conductor pattern and a protective film that covers the first conductor pattern are provided in the first region of the first main surface. Second conductor patterns and holes that extend to the second conductor patterns are provided in the second region of the multilayer body. The holes are provided with conductive joining materials, and connectors are connected to the second conductor patterns by the conductive joining materials.