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公开(公告)号：US10083887B2
公开(公告)日：2018-09-25
申请号：US14043381
申请日：2013-10-01
发明人： Yoichi Saito , Toru Yoshioka
CPC分类号： H01L23/3121 , H01L2224/16225 , H01L2924/15313 , H05K1/184 , H05K1/186 , H05K3/4617 , H05K3/4632 , H05K2201/09781 , H05K2201/10636 , H05K2203/063 , Y02P70/611
摘要： The present invention provides a chip component-embedded resin multilayer substrate including a laminating body obtained by laminating a plurality of resin layers, a predetermined wiring conductor disposed in the laminating body, and a chip component embedded in the laminating body and having a side terminal electrode. A guarding member electrically isolated from the wiring conductor is provided to cover at least a part of a boundary between the side terminal electrode and the resin layers when viewed from a lamination direction of the laminating body, and the guarding member is formed from a material having a melting point higher than a temperature at which the resin layer begins to flow.
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公开(公告)号：US10236264B2
公开(公告)日：2019-03-19
申请号：US15234227
申请日：2016-08-11
发明人： Naoto Ikeda , Shunji Mandai , Yoichi Saito
IPC分类号： G06K19/00 , H01L23/66 , G06K19/077 , H01L21/48 , H01L23/498 , H01L23/00 , H01L23/31 , H01Q1/22 , H01Q7/00
摘要： A wireless IC device includes an element body including first and second principal surfaces, an RFIC element buried in the element body, and an antenna coil disposed in the element body. The antenna coil includes a first wiring pattern provided on the second principal surface, a first metal pin reaching the first principal surface and the second principal surface, a second metal pin reaching the first principal surface and the second principal surface, and a second wiring pattern provided on the first principal surface. Terminal surfaces of the first input/output terminal and the second input/output terminal of the RFIC element face the second principal surface of the element body and are spaced away from the antenna coil while being connected to the first wiring pattern through first and second conductors extending from the second principal surface of the element body in a direction of the first primary surface.
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公开(公告)号：US20170373389A1
公开(公告)日：2017-12-28
申请号：US15681669
申请日：2017-08-21
发明人： Shunji Mandai , Yoichi Saito
CPC分类号： H01Q1/52 , G06K7/10356 , H01Q1/2216 , H01Q1/2225 , H01Q7/00
摘要： An antenna apparatus having a substrate, an antenna on the substrate, and a power supply circuit element on the substrate and connected to the antenna. The antenna includes coil-shaped first and second coil antenna units respectively having coil axes that intersect with the substrate. The first coil antenna unit and the second coil antenna unit are arranged on the substrate such that a direction in which a current flows through one of the coil antenna units is clockwise and a direction in which the current flows through the other of the coil antenna units is counterclockwise. The power supply circuit element is positioned between the first coil antenna unit and the second coil antenna unit.
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公开(公告)号：US09582747B2
公开(公告)日：2017-02-28
申请号：US14686894
申请日：2015-04-15
发明人： Yoichi Saito
IPC分类号： G06K19/077 , H01L23/66 , H01L21/52 , H01L23/498 , H01L23/31 , H01L23/00 , H01L23/14
CPC分类号： G06K19/07752 , G06K19/07722 , G06K19/07786 , H01L21/52 , H01L23/145 , H01L23/3128 , H01L23/4985 , H01L23/66 , H01L24/16 , H01L2223/6677 , H01L2224/16225 , H01L2924/1421 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579
摘要： An antenna conductor and a reinforcing layer are provided on an upper surface and a lower surface, respectively, of a flexible base film. An RFIC element is mounted on the upper surface of the base film. Two I/O terminals provided on the RFIC element are each connected to meander patterns of the antenna conductor. In a plan view, the reinforcing layer has a circular contour, and the RFIC element is surrounded by the contour of the reinforcing layer. The two I/O terminals provided on the RFIC element are exposed on the upper surface of the base film. Breakage of the connected portion between the RFIC element and the antenna conductor is prevented, and any breakage that has occurred is easily identified.
摘要翻译： 天线导体和增强层分别设置在柔性基底膜的上表面和下表面上。 RFIC元件安装在基底膜的上表面上。 设置在RFIC元件上的两个I / O端子各自连接到天线导体的曲折图案。 在平面图中，加强层具有圆形轮廓，并且RFIC元件被加强层的轮廓包围。 设置在RFIC元件上的两个I / O端子在基膜的上表面上露出。 防止RFIC元件与天线导体之间的连接部分的断裂，容易识别发生的任何断裂。
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5.发明申请CHIP COMPONENT-EMBEDDED RESIN MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF 审中-公开芯片组件嵌入式树脂多层基板及其制造方法公开(公告)号：US20140029222A1
公开(公告)日：2014-01-30
申请号：US14043381
申请日：2013-10-01
发明人： Yoichi Saito , Toru Yoshioka
CPC分类号： H01L23/3121 , H01L2224/16225 , H01L2924/15313 , H05K1/184 , H05K1/186 , H05K3/4617 , H05K3/4632 , H05K2201/09781 , H05K2201/10636 , H05K2203/063 , Y02P70/611
摘要： The present invention provides a chip component-embedded resin multilayer substrate including a laminating body obtained by laminating a plurality of resin layers, a predetermined wiring conductor disposed in the laminating body, and a chip component embedded in the laminating body and having a side terminal electrode. A guarding member electrically isolated from the wiring conductor is provided to cover at least a part of a boundary between the side terminal electrode and the resin layers when viewed from a lamination direction of the laminating body, and the guarding member is formed from a material having a melting point higher than a temperature at which the resin layer begins to flow.
摘要翻译： 本发明提供一种片状部件嵌入式树脂多层基板，其包括层叠多个树脂层而得到的层叠体，配置在层叠体中的规定布线导体和嵌入层叠体的芯片部件，具有侧端子电极 。 设置与布线导体电绝缘的防护部件，以覆盖从层叠体的层叠方向观察时的侧端子电极与树脂层的边界的至少一部分，并且防护部件由具有 熔点高于树脂层开始流动的温度。
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公开(公告)号：US11915084B2
公开(公告)日：2024-02-27
申请号：US17660073
申请日：2022-04-21
发明人： Hiromi Murayama , Noboru Kato , Noriyuki Ueki , Yoichi Saito , Makoto Yasutake
IPC分类号： G06K19/077 , H01Q7/00
CPC分类号： G06K19/07773 , H01Q7/00
摘要： An antenna device is provided as a near-field communication antenna device that is configured by arranging a plurality of loop antennas. Each loop antenna includes a plurality of parallel circuits each having a capacitor and a resistance element; and a plurality of looped conductors in a shape of a loop that is divided. The divided looped conductors are connected to each other via the parallel circuits, and the plurality of looped conductors and the plurality of parallel circuits form a loop.
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公开(公告)号：US08975986B2
公开(公告)日：2015-03-10
申请号：US14196269
申请日：2014-03-04
发明人： Kanto Iida , Yoichi Saito , Satoshi Sasaki , Noboru Kato
CPC分类号： H01P3/082 , H05K1/0225 , H05K1/025 , H05K1/0271 , H05K1/028 , H05K1/115 , H05K1/162 , H05K2201/09709 , H05K2201/09727 , H05K2201/09845
摘要： A high-frequency signal transmission line includes a flexible body including a plurality of insulating layers. A linear signal line is located in or on the body. A first ground conductor is located opposite to the signal line via at least one of the insulating layers. A second ground conductor extends along the signal line. An interlayer connection portion that connects the first ground conductor and the second ground conductor includes a plurality of interlayer connection conductors individually pierced in some of6 the insulating layers and connected to each other. The plurality of interlayer connection conductors includes two interlayer connection conductors that are pierced in adjacent ones of the insulating layers with respect to a layer-stacking direction and that have central axes located in different positions when viewed from the layer-stacking direction.
摘要翻译： 高频信号传输线包括具有多个绝缘层的柔性主体。 线性信号线位于身体中或身上。 第一接地导体经由至少一个绝缘层位于与信号线相对的位置。 第二个接地导体沿信号线延伸。 连接第一接地导体和第二接地导体的层间连接部分包括多个层间连接导体，其分别穿过绝缘层中的一些并彼此连接。 多个层间连接导体包括两层层间连接导体，其相对于层堆叠方向在相邻的绝缘层中被刺穿，并且当从层堆叠方向观察时具有位于不同位置的中心轴。
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公开(公告)号：US12033022B2
公开(公告)日：2024-07-09
申请号：US17742950
申请日：2022-05-12
发明人： Hiromi Murayama , Noboru Kato , Yoichi Saito , Noriyuki Ueki , Makoto Yasutake
IPC分类号： H01Q1/22 , G06K7/10 , G06K19/077 , H01Q7/00
CPC分类号： G06K7/10316 , G06K19/07773 , H01Q1/2208 , H01Q7/00
摘要： An RFID auxiliary antenna device is provided on an article that is adjacent to an RFID tag to be communicated or accommodates the RFID tag. The RFID auxiliary antenna device includes a conductive pattern that circles the article. A capacitance component generated between conductive patterns and an inductance component of the conductive pattern configure a resonant circuit. A resonant frequency of the resonant circuit is equal to or substantially equal to a communication frequency of the RFID tag, and the RFID auxiliary antenna device is magnetically coupled to each of the RFID tag and a reader/writer.
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9.发明授权公开(公告)号：US11056808B2
公开(公告)日：2021-07-06
申请号：US16266156
申请日：2019-02-04
发明人： Jun Sasaki , Yoichi Saito , Takahiro Baba , Fumie Matsuda , Yoshitomo Tanaka
摘要： A module includes a multilayer body that includes insulating-resin base members laminated together, first and second main surfaces, and first and second regions when viewed in plan view. A first conductor pattern and a protective film that covers the first conductor pattern are provided in the first region of the first main surface. Second conductor patterns and holes that extend to the second conductor patterns are provided in the second region of the multilayer body. The holes are provided with conductive joining materials, and connectors are connected to the second conductor patterns by the conductive joining materials.
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公开(公告)号：US09070490B2
公开(公告)日：2015-06-30
申请号：US13928720
申请日：2013-06-27
发明人： Koji Shiroki , Yoichi Saito , Hiromasa Koyama , Hirotaka Fujii , Noboru Kato
摘要： A transmission line portion of a flat cable that is bent at a position along the longitudinal direction includes a dielectric element body, a first ground conductor, and a second ground conductor. The dielectric element body includes a signal conductor at the middle position of the thickness direction. The first ground conductor includes elongated conductors and bridge conductors. The elongated conductors are spaced in the width direction of the dielectric element body, and extend in the longitudinal direction. The bridge conductors connect the elongated conductors at spacings along the longitudinal direction. The spacing of bridge conductors across the bending point in a bent portion is smaller than the spacing of adjacent bridge conductors located in a straight portion.
摘要翻译： 扁平电缆的沿着纵向位置弯曲的传输线部分包括电介质元件本体，第一接地导体和第二接地导体。 电介质元件主体包括在厚度方向的中间位置处的信号导体。 第一接地导体包括细长导体和桥导体。 细长导体沿电介质元件主体的宽度方向间隔开，并沿纵向方向延伸。 桥导体沿着纵向方向以间隔连接细长导体。 在弯曲部分中跨越弯曲点的桥导体的间隔小于位于直线部分中的相邻桥导体的间隔。
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