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公开(公告)号:US5075262A
公开(公告)日:1991-12-24
申请号:US482489
申请日:1990-02-21
申请人: My N. Nguyen , Mark A. Blocker
发明人: My N. Nguyen , Mark A. Blocker
IPC分类号: H01L21/52 , C03C8/18 , H01B1/16 , H01L21/60 , H01L23/498
CPC分类号: H01L24/83 , C03C8/18 , H01B1/16 , H01L23/49883 , H01L24/29 , H01L2224/29101 , H01L2224/29288 , H01L2224/29339 , H01L2224/8319 , H01L2224/8384 , H01L2224/8389 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/10253 , H01L2924/15787
摘要: An improved silver-glass paste for bonding a semiconductive element to a substrate comprising a metal resinate. A surfactant containing lyophilic and lyophobic groups may also be included.