公开(公告)号：US10062620B1

公开(公告)日：2018-08-28

申请号：US15487193

申请日：2017-04-13

申请人： NANYA TECHNOLOGY CORPORATION

发明人： Jui-Chung Hsu ,  Wu-Der Yang ,  Chia-Chi Hsu

IPC分类号： H01L23/045 ,  H01L23/552

摘要： A die device includes a die including an active layer; and an interconnect feature configured for electrical connection of the active layer, wherein the interconnect feature is in contact with a substrate in the die; and a bump, independent of the die, configured for electrical connection of the active layer.

公开(公告)号：US11598806B2

公开(公告)日：2023-03-07

申请号：US17155043

申请日：2021-01-21

申请人： NANYA TECHNOLOGY CORPORATION

发明人： Yu-Wei Tseng ,  Chih-Ming Chang ,  Wan-Chun Fang ,  Jui-Chung Hsu ,  Chun-Hsi Li

IPC分类号： G01R31/317

摘要： A test system is disclosed. The test system includes a tester, a first voltage stabilization circuit, and a device under test (DUT). The tester generates a first operational voltage and a control signal. The first voltage stabilization circuit transmits a second operational voltage, associated with the first operational voltage, to a socket board. The DUT operates with the second operational voltage received through the socket board. The first voltage stabilization circuit is further configured to control, according to the control signal, the second operational voltage to have a first voltage level when the DUT is operating.