公开(公告)号：US20190172691A1

公开(公告)日：2019-06-06

申请号：US15974858

申请日：2018-05-09

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： CHOU-YU LIN ,  HUI-YUN BOR ,  CHAO-NAN WEI ,  CHIEN-HUNG LIAO ,  SHEA-JUE WANG ,  SHIH-FAN CHEN

IPC: H01J37/34

Abstract: A heating carrier device for use on a sputtering cathode assembly has a heating carrier for heating a sputtering target to control a sputtering target temperature; a magnetic component for generating a magnetic field; a thermal insulation component disposed between the heating carrier and the magnetic component; and a cooling system for cooling the magnetic component. Therefore, the heating carrier device reduces the bonding strength of the sputtering target, reduces the particle size of sputtering products, and grows high-quality, uniform thin films.