公开(公告)号：US10329681B2

公开(公告)日：2019-06-25

申请号：US15801496

申请日：2017-11-02

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Chi-Haw Chiang ,  Liang-Huei Jiang ,  Ren-Ruey Fang ,  Chien-Liang Chang ,  Yu-Ping Wang ,  Ming-Ta Hsieh

IPC: C25D3/58 ,  C25D3/64 ,  H01L21/768

Abstract: A copper-silver dual-component metal electroplating solution includes copper methanesulfonate, silver methanesulfonate, methanesulfonic acid, chlorine ions, and water. An electroplating method for forming a copper-silver dual-component metal by using such an electroplating solution, the steps of which includes (a) contacting the copper-silver dual-component metal electroplating solution with a substrate; (b) applying an operating voltage, the current density of which is controlled to be between 0.1 and 2 ASD in order to carry out electroplating on the substrate. Therefore, the electroplating solution has environmental characteristics, such as less poisoning hazards, through the design of methanesulfonic acid and methanesulfonate electroplating solution. Also, the potential and the current are adjusted during the electroplating in order to obtain a copper-silver dual-component metal plating layer with a specific silver content.

公开(公告)号：US09472851B2

公开(公告)日：2016-10-18

申请号：US14551192

申请日：2014-11-24

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Chi-Haw Chiang ,  Chia-Hua Chang ,  Chih Wang ,  Chun-Yu Lee

IPC: H01Q1/46 ,  H01Q9/04

CPC classification number: H01Q9/045 ,  H01Q9/0471

Abstract: A nonplanar antenna embedded package structure and a method of manufacturing the same are introduced. The structure includes a nonplanar antenna component. The nonplanar antenna component comprises an antenna substrate, metal wiring, through-hole, and metal bump. The substrate surface covers the metal wiring. The through-hole penetrates the substrate from the antenna substrate bottom side but does not penetrate the metal wiring, and does not affect its appearance. The metal bump is implanted in the through-hole from the antenna substrate bottom side to join the metal wiring. An electronic component having a copper cable is provided. An end of the copper cable protrudes from the electronic component and is inserted into the through-hole of the antenna component to join the metal bump, thereby forming the nonplanar antenna embedded package structure characterized by: preventing the antenna metal wiring from exposing, and reducing interference otherwise arising from antenna resonance frequency and noise.

Abstract translation: 介绍了非平面天线嵌入式封装结构及其制造方法。 该结构包括非平面天线部件。 非平面天线部件包括天线基板，金属布线，通孔和金属凸块。 基板表面覆盖金属布线。 通孔从天线基板底侧穿透基板，但不穿透金属布线，并且不影响其外观。 金属凸块从天线基板底侧注入到通孔中以连接金属布线。 提供具有铜缆的电子部件。 铜电缆的一端从电子部件伸出并插入到天线部件的通孔中以接合金属凸块，从而形成非平面天线嵌入式封装结构，其特征在于：防止天线金属布线暴露，并且减少 由天线共振频率和噪声引起的干扰。