Method and apparatus for stably evaporation depositing uniform thin films
    2.
    发明授权
    Method and apparatus for stably evaporation depositing uniform thin films 有权
    用于稳定蒸发沉积均匀薄膜的方法和装置

    公开(公告)号:US09574264B2

    公开(公告)日:2017-02-21

    申请号:US14716882

    申请日:2015-05-20

    CPC classification number: C23C14/24 C23C14/243

    Abstract: In a method for evaporation depositing uniform thin films, a film is deposited on a substrate of a vacuum environment while maintaining a constant deposition rate. A cover is installed on a wall of the evaporation vessel. When the evaporation material is heated to an evaporation state and the interior of the evaporation vessel reaches a first vapor saturation pressure, the vapor of the evaporation material flows towards a pressure stabilizing chamber. When the pressure stabilizing chamber reaches a second vapor saturation pressure which is smaller than the first vapor saturation pressure, the vacuum environment has a vacuum background pressure which is smaller than the second vapor saturation pressure, so that the evaporation material vapor flows from the pressure stabilizing chamber towards the vacuum environment at constant rate due to the pressure difference, so as to evaporate the substrate.

    Abstract translation: 在用于蒸发沉积均匀薄膜的方法中,将膜沉积在真空环境的基板上,同时保持恒定的沉积速率。 一个盖子安装在蒸发容器的墙壁上。 当蒸发材料被加热到蒸发状态并且蒸发容器的内部达到第一蒸气饱和压力时,蒸发材料的蒸气朝向压力稳定室流动。 当压力稳定室达到小于第一蒸汽饱和压力的第二蒸气饱和压力时,真空环境的真空背景压力小于第二蒸汽饱和压力,使得蒸发材料蒸汽从压力稳定 由于压力差,以恒定速率朝向真空环境室,以便使基板蒸发。

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