公开(公告)号：US20010028544A1

公开(公告)日：2001-10-11

申请号：US09826253

申请日：2001-04-04

申请人： NEC Corporation

发明人： Mitsunori Sano ,  Kazunori Watanabe ,  Hideaki Sato ,  Kazuhiro Mine

IPC分类号： H01G004/00

CPC分类号： H01G9/012 ,  H01G2/065

摘要： The present invention provides a chip capacitor, a fabrication method for the same, and a metal mold that can prevent the occurrence of the chip standing phenomenon even when carrying out soldering using reflow soldering, and that be applied to further down-sizing an decreasing of weight. Curved parts 26 and 36 that extend beyond the connecting tongue pieces 21 and 31 of side piece parts 22 and 23 rising in an upward diagonal direction with respect to the connecting tongue pieces 21 and 31 are formed by press bending processing, and thereby the side piece parts 22 and 32 are exposed in an upward rising direction relative to the connecting tongue pieces 21 and 31 at the external end surfaces 15b and 15c of the external resin packaging.

摘要翻译： 本发明提供了一种片状电容器及其制造方法，以及即使在使用回流焊接进行焊接的情况下也能够防止芯片立起现象的发生的金属模具，并且适用于进一步减小尺寸 重量。 通过压弯加工形成延伸超过相对于连接舌片21和31向上对角线方向上升的侧片部件22和23的连接舌片21和31的弯曲部分26和36， 部件22和32相对于外部树脂封装的外端面15b和15c处的连接舌片21和31向上升的方向露出。

公开(公告)号：US20020061613A1

公开(公告)日：2002-05-23

申请号：US09987251

申请日：2001-11-14

申请人： NEC CORPORATION

发明人： Mitsunori Sano ,  Takashi Kono ,  Kazunori Watanabe

IPC分类号： H01L021/338

CPC分类号： H01G9/012 ,  Y10T29/417 ,  Y10T29/49254

摘要： An anode lead 17 extending from a capacitor body 18 of a capacitor element 14 is mounted on a connecting portion 21 of an anode terminal 12 and the anode lead 17 and the connecting portion 21 are welded together by laser light B. The welding operation is performed by laser light B in a state where the anode lead 17 is urged to the connecting portion 21 in a region between said anode lead and said connecting portion. Alternatively, the welding operation is performed by laser light B in a state where a reflection plate having a slot and functioning to reflect reflected laser light is arranged in a region between the connecting portion and the capacitor body while the anode lead is received in said slot.

摘要翻译： 从电容器元件14的电容器主体18延伸的阳极引线17安装在阳极端子12的连接部分21上，阳极引线17和连接部分21通过激光B焊接在一起。进行焊接操作 在阳极引线17和所述连接部之间的区域中将阳极引线17推压到连接部21的状态下通过激光B。 或者，通过激光B进行焊接操作，其中具有狭缝的反射板并且用于反射反射的激光的功能被布置在连接部分和电容器主体之间的区域中，同时阳极引线被接收在所述插槽 。