公开(公告)号：US20020037680A1

公开(公告)日：2002-03-28

申请号：US09852179

申请日：2001-05-09

Applicant: NEC Corporation

Inventor： Yoshihiro Hayashi ,  Takahiro Onodera ,  Yamato Samitsu ,  Kiyoshi Tanaka ,  Naoki Sasaki

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/105 ,  B24B37/042

Abstract: In an apparatus for polishing a substrate, including a polishing platen for mounting the substrate thereon, a polishing head, a polishing pad adhered to a bottom face of the polishing head, and a rocking section for rocking. I.e., moving the polishing head in the horizontal direction with respect to the polishing platen, a control circuit controls a load of the polishing pad applied to the substrate in accordance with a contact area of the polishing pad to the substrate.

Abstract translation: 在用于抛光基板的装置中，包括用于将基板安装在其上的抛光台板，抛光头，粘附到抛光头底面的抛光垫和用于摇摆的摇摆部分。 即，相对于研磨台板沿水平方向移动抛光头，控制电路根据抛光垫与基板的接触面积来控制施加到基板上的抛光垫的载荷。