公开(公告)号：US09390948B2

公开(公告)日：2016-07-12

申请号：US14953226

申请日：2015-11-27

Applicant: NEC Engineering, Ltd.

Inventor： Yoichiro Taga ,  Eiichiro Aoki

IPC: B29C65/00 ,  B32B37/00 ,  H01L21/00 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67132 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/6838 ,  Y10T156/17

Abstract: A tape attaching apparatus includes: a chamber having an airtight space formed therein; a rubber sheet that partitions the airtight space into first and second airtight spaces and has an upper sheet on which a wafer is placed; a tape frame that holds a tape above the rubber sheet; and first and second supply/exhaust tubes that switch pressurization and depressurization of the first and second airtight spaces. In pressurizing the second airtight space and expanding the rubber sheet to lift the wafer to be attached to the tape, after bringing the first and second airtight spaces into a vacuum state, the wafer is attached to the tape while an amount of pressurization of the second airtight space is controlled to change an expansion rate of the rubber sheet from a low speed to a high speed stepwisely.

Abstract translation: 胶带附着装置包括：形成有气密空间的室; 橡胶片，其将所述气密空间分隔成第一和第二气密空间，并具有放置晶片的上片; 将胶带保持在橡胶板上方的胶带框架; 以及第一和第二供应/排气管，其切换第一和第二气密空间的加压和减压。 在对第二气密空间进行加压并使橡胶片膨胀以提升要附着在带上的晶片时，在将第一和第二气密空间置于真空状态之后，将晶片附着到带上，同时第二 控制气密空间以将橡胶片的膨胀率从低速逐步地改变到高速。

公开(公告)号：US20160079098A1

公开(公告)日：2016-03-17

申请号：US14953226

申请日：2015-11-27

Applicant: NEC Engineering, Ltd.

Inventor： Yoichiro Taga ,  Eiichiro Aoki

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67132 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/6838 ,  Y10T156/17

Abstract: A tape attaching apparatus includes: a chamber having an airtight space formed therein; a rubber sheet that partitions the airtight space into first and second airtight spaces and has an upper sheet on which a wafer is placed; a tape frame that holds a tape above the rubber sheet; and first and second supply/exhaust tubes that switch pressurization and depressurization of the first and second airtight spaces. In pressurizing the second airtight space and expanding the rubber sheet to lift the wafer to be attached to the tape, after bringing the first and second airtight spaces into a vacuum state, the wafer is attached to the tape while an amount of pressurization of the second airtight space is controlled to change an expansion rate of the rubber sheet from a low speed to a high speed stepwisely.

Abstract translation: 胶带附着装置包括：形成有气密空间的室; 橡胶片，其将所述气密空间分隔成第一和第二气密空间，并具有放置晶片的上片; 将胶带保持在橡胶板上方的胶带框架; 以及第一和第二供应/排气管，其切换第一和第二气密空间的加压和减压。 在对第二气密空间进行加压并使橡胶片膨胀以提升要附着在带上的晶片时，在将第一和第二气密空间置于真空状态之后，将晶片附着到带上，同时第二 控制气密空间以将橡胶片的膨胀率从低速逐步地改变到高速。