公开(公告)号：US10215456B2

公开(公告)日：2019-02-26

申请号：US15036464

申请日：2014-12-05

申请人： NEC Corporation ,  NEC Platforms, Ltd.

发明人： Arihiro Matsunaga ,  Masaki Chiba ,  Minoru Yoshikawa ,  Tadao Hosaka ,  Shunsuke Fujii ,  Akira Shoujiguchi ,  Kenichi Inaba ,  Masanori Sato

IPC分类号： F25B39/00 ,  F28D15/02 ,  H05K7/20 ,  F25B23/00 ,  F25B39/02 ,  F28D15/06

摘要： In order to supply a refrigerant to multiple-stage heat receivers equally while saving space, a refrigerant distribution device to distribute a refrigerant supplied from the upper stream according to the present invention includes a main body including a side wall part, an upper face part and a bottom face part, an upstream pipe provided on the upper face part in a manner communicating with an inside of the main body, a downstream pipe provided in a state partially inserted inside the main body via an under face hole part provided in the bottom face part, a tributary pipe provided in the side wall part or the bottom face part in a manner communicating with the inside of the main body, and a refrigerant direction changing means provided between the upstream pipe and the downstream pipe.

公开(公告)号：US10788270B2

公开(公告)日：2020-09-29

申请号：US15768306

申请日：2016-10-14

申请人： NEC Platforms, Ltd.

发明人： Yasuhito Nakamura ,  Shunsuke Fujii

IPC分类号： F28D15/06 ,  H05K7/20 ,  F28D15/02 ,  F25B43/00

摘要： A refrigerant relay device 1300 is provided with a casing 1310, a first refrigerant inflow opening 1360, a first refrigerant outflow opening 1350, and refrigerant inflow piping 1370. The casing retains liquid-phase refrigerant and gas-phase refrigerant. The liquid-phase refrigerant is made to flow into the casing through the first refrigerant inflow opening. The gas-phase refrigerant is made to flow out to the outside of the casing through the first refrigerant outflow opening. In the refrigerant inflow piping, one end is connected to the first refrigerant inflow opening and an opening 1371 is formed at the other end. The liquid-phase refrigerant flowing into the first refrigerant inflow opening is made to flow into the casing through the refrigerant inflow piping from the opening. The opening is positioned so as to face the bottom part 1311 of the casing.

公开(公告)号：US10408545B2

公开(公告)日：2019-09-10

申请号：US15105950

申请日：2014-12-02

申请人： NEC PLATFORMS, LTD.

发明人： Yasuhito Nakamura ,  Shunsuke Fujii

IPC分类号： F28D15/02 ,  H05K7/20 ,  F28D15/06 ,  G06F1/20

摘要： A cooling system includes a heat absorbing device which has a first pipe port and absorbs heat discharged from equipment by using refrigerant; a radiator which has a second pipe port placed higher than the first pipe port and cools the refrigerant; a first flexible pipe whose one end is connected with the first pipe port and whose another end is connected with the second pipe port and through which the refrigerant flows and which can bend freely; and a loading table having a surface which becomes higher in a vertical direction as approaching from one end of the surface to another end, and on which the first flexible pipe is placed so as to become higher in the vertical direction as approaching from a side of the first flexible pipe, which is connected with the first pipe port, to a side of the first flexible pipe which is connected with the second pipe port.

公开(公告)号：US10203163B2

公开(公告)日：2019-02-12

申请号：US15513245

申请日：2015-10-14

申请人： NEC Platforms, Ltd.

发明人： Shunsuke Fujii

IPC分类号： F28D15/02 ,  H05K7/20

摘要： The purpose of the present invention is to more efficiently cool exhaust heat, of an apparatus or the like that emits heat, by preventing a situation where a gas-phase medium is cooled and turns into a liquid-phase medium and thereby transfer of the gas-phase medium is hindered. For this purpose, a cooling system includes a heat receiving means for receiving a gas heated by heat emitted by an electronic apparatus and changing a liquid-phase heat medium into a gas-phase heat medium. a heat radiation means for cooling the gas-phase heat medium so as to be changed into the liquid-phase heat medium. a first transfer means for transferring the gas-phase heat medium from the heat receiving means to the heat radiation means. and a second transfer means for transferring the liquid-phase heat medium from the heat radiation means to the heat receiving means. wherein at least part of the first transfer means is heated by the heat emitted by the electronic apparatus.