公开(公告)号：US08971045B1

公开(公告)日：2015-03-03

申请号：US13731014

申请日：2012-12-30

申请人： NETLIST, Inc.

发明人： Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

IPC分类号： H05K7/20 ,  H05K1/02

CPC分类号： H05K1/0203 ,  H05K1/144 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913

摘要： A module is electrically connectable to a computer system. The module includes an edge connector with a plurality of electrical contacts electrically connectable to the computer system, at least one layer of thermally conductive material thermally coupled to the edge connector, and first and second printed circuit boards each having a plurality of integrated circuit components that are electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material. The at least one layer of thermally conductive material are disposed between the first and second printed circuit boards.

摘要翻译： 模块可电连接到计算机系统。 模块包括边缘连接器，其具有可电连接到计算机系统的多个电触点，热耦合到边缘连接器的至少一层导热材料，以及第一和第二印刷电路板，每个具有多个集成电路部件， 电耦合到边缘连接器并且热耦合到至少一个导热材料层。 至少一层导热材料设置在第一和第二印刷电路板之间。