公开(公告)号：US20240138052A1

公开(公告)日：2024-04-25

申请号：US18483870

申请日：2023-10-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO

IPC: H05K1/02 ,  H01L23/367 ,  H01L25/10 ,  H01L25/16 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H01L23/3675 ,  H01L25/105 ,  H01L25/162 ,  H05K1/144 ,  H05K1/181 ,  H01L2225/1094 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/1056

Abstract: A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an upper circuit board. As viewed in the downward direction, a heat conduction member overlaps the first component, is disposed in a space between the first lower main surface and the second upper main surface, and is coupled to the first conductor layer via a conductor. A part of a heat dissipation member is exposed from the first sealing resin in a direction orthogonal to an up-down axis.

公开(公告)号：US20180350751A1

公开(公告)日：2018-12-06

申请号：US15973541

申请日：2018-05-08

Applicant: MEDIATEK INC.

Inventor： Ruey-Bo Sun ,  Wen-Chou Wu

IPC: H01L23/552 ,  H01L23/373 ,  H01L23/06 ,  H01L23/64 ,  H01L25/065

CPC classification number: H01L23/66 ,  H01L23/552 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/0216 ,  H05K7/20454 ,  H05K9/0032 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/1056

Abstract: A microelectronic assembly includes a substrate and a first microelectronic component mounted on the substrate. The first microelectronic component includes a digital/analog IP block and a RF IP block. A shielding case is mounted on the substrate. The shielding case includes a plurality of sidewalls, one intermediate wall, and a lid. A thermal interface material (TIM) layer is situated between the lid and the first microelectronic component. A noise suppressing structure is interposed between the TIM layer and the first microelectronic component.

公开(公告)号：US20180324940A1

公开(公告)日：2018-11-08

申请号：US16034596

申请日：2018-07-13

Applicant: Avago Technologies General IP (Singapore) Pte. Ltd

Inventor： Deog-Soon Choi ,  Chang-Yul Cheon ,  Sang-Hwa Jung ,  Sung-Phyo Lim ,  Ah Ron Lee

IPC: H05K1/02 ,  H01F27/36

CPC classification number: H05K1/0216 ,  H01F27/362 ,  H05K1/023 ,  H05K2201/09972 ,  H05K2201/10287 ,  H05K2201/1056

Abstract: A compartment EMI shield for use inside of a system module package is provided that comprises at least a first set of electrically-conductive wires that surrounds and extends over circuitry of the module package. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the compartment EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire that is located in between the first and second ends of the respective wire extends above the circuitry and is spaced apart from the components of the circuitry so as not to be in contact with the components of the circuitry.

公开(公告)号：US20180270997A1

公开(公告)日：2018-09-20

申请号：US15919257

申请日：2018-03-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Joon LEE ,  Yong Won LEE ,  Hyun Tae JANG

IPC: H05K9/00 ,  H05K1/18

CPC classification number: H05K9/0024 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/111 ,  H05K1/181 ,  H05K9/0028 ,  H05K9/0033 ,  H05K2201/10159 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K2201/1056

Abstract: An electronic device includes a printed circuit board (PCB) including a first surface, a second surface facing a direction opposite the first surface, and a side surface surrounding a space between the first surface and the second surface, at least one component disposed on the first surface, a shield can surrounding the at least one component and a partial area of the PCB, and an adhesive that bonds the shield can and the first surface, and that bonds the shield can and the second surface, and at least a portion of the shield can does not bond with the side surface.

公开(公告)号：US20180068957A1

公开(公告)日：2018-03-08

申请号：US15796523

申请日：2017-10-27

Applicant: International Business Machines Corporation

Inventor： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, JR. ,  David B. Stone

IPC: H01L23/552 ,  H01L23/367 ,  H05K1/16 ,  H01L25/16 ,  H05K1/14 ,  H05K1/02 ,  H01L25/18 ,  H01L25/065 ,  H01L23/00 ,  H01L23/64 ,  H01L23/50 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/1624 ,  H01L2224/17181 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H02J7/0042 ,  H02J7/0052 ,  H02J7/345 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/144 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/041 ,  H05K2201/0999 ,  H05K2201/10515 ,  H05K2201/1056 ,  H01L2924/014 ,  H01L2924/00

Abstract: Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.

公开(公告)号：US09913412B2

公开(公告)日：2018-03-06

申请号：US14308386

申请日：2014-06-18

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar S. Pennathur

IPC: H05K7/00 ,  H05K9/00 ,  H05K1/02 ,  H05K3/28 ,  H05K1/18 ,  H05K1/16

CPC classification number: H05K9/0024 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K1/0215 ,  H05K1/0218 ,  H05K3/284 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/1056

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer. In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.

公开(公告)号：US20180061570A1

公开(公告)日：2018-03-01

申请号：US15802383

申请日：2017-11-02

Applicant: Deere & Company

Inventor： Christopher J. Schmit ,  Neal D. Clements ,  Andrew D. Wieland

IPC: H01G2/08 ,  H01G4/32 ,  H01G4/38 ,  H01G4/228 ,  H05K1/18 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01G2/08 ,  H01G4/228 ,  H01G4/32 ,  H01G4/38 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/1056 ,  H05K2201/10651

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

公开(公告)号：US09907157B2

公开(公告)日：2018-02-27

申请号：US14656237

申请日：2015-03-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Se Jong Kim ,  Sang Ho Choi ,  Jeong Hae Kim ,  Hyung Jun Cho

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0218 ,  H05K1/0243 ,  H05K1/185 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2201/10553 ,  H05K2201/1056 ,  H05K2203/0191

Abstract: There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board includes: a core layer having a cavity provided therein; an electronic component included in the cavity; a conductive partition disposed on a side of the cavity; and insulating layers disposed on and below the core layer.

公开(公告)号：US20180024600A1

公开(公告)日：2018-01-25

申请号：US15642492

申请日：2017-07-06

Applicant: LENOVO (SINGAPORE) PTE. LTD.

Inventor： YASUHIRO HORIUCHI

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F1/203 ,  G06F2200/203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K2201/066 ,  H05K2201/10409 ,  H05K2201/1056

Abstract: A screw hole which is formed on one end of a substrate and through which an electronic device is attached to a metal frame by using a metal screw provided, an NAND memory as a heating section is provided on the screw hole side, a heat conducting sheet which covers an upper peripheral portion of the screw hole and an upper portion of the NAND memory is provided, and heat of the NAND memory is conducted to the metal frame through the heat conducting sheet and the metal screw fitted into the screw hole.

公开(公告)号：US20170339790A1

公开(公告)日：2017-11-23

申请号：US15674273

申请日：2017-08-10

Applicant: Conti Temic microelectronic GmbH

Inventor： Frieder Wittmann ,  Karin Beart ,  Stefan Müller ,  Thomas Schmidt ,  Bernhard Schuch

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K1/181 ,  H05K1/0204 ,  H05K1/11 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/341 ,  H05K7/205 ,  H05K2201/066 ,  H05K2201/09745 ,  H05K2201/10227 ,  H05K2201/10545 ,  H05K2201/1056 ,  H05K2203/049

Abstract: The disclosure relates to an electronic component that includes a printed circuit board with two opposite flat sides and a plurality of electronic components, and a base plate. A number of the electronic components are each fixed on and electrically conductively connected to a rear flat side of the printed circuit board and a further number of the electronic components are each fixed on and electrically conductively connected to a front flat side of the printed circuit board. The base plate has at least one first cutout for receiving electronic components that are arranged on the rear flat side of the printed circuit board. The disclosure also relates to a method for producing an electronic component of this kind.