WAFER PLACEMENT TABLE
    1.
    发明公开

    公开(公告)号:US20240274413A1

    公开(公告)日:2024-08-15

    申请号:US18366085

    申请日:2023-08-07

    CPC classification number: H01J37/32715 H01J2237/2007

    Abstract: A wafer placement table includes: a ceramic plate having a pore extending vertically through the ceramic plate, a conductive plate bonded to a lower surface of the ceramic plate and having a gas supply passage; a plug chamber that is in communication with the pore and the gas supply passage; an insulating gas passage plug located in the plug chamber and a dense insulating film. The dense insulating film allows ventilation at a gas outlet portion that is a portion of an upper surface of the insulating gas passage plug and serves as a gas flow path to the pore, and the dense insulating film is disposed across the upper surface of the conductive plate and the upper surface of the insulating gas passage plug to cover a boundary between the upper surface of the conductive plate and the upper surface of the insulating gas passage plug.

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