公开(公告)号：US20240186170A1

公开(公告)日：2024-06-06

申请号：US18346951

申请日：2023-07-05

Applicant: NGK INSULATORS, LTD.

Inventor： Natsuki HIRATA ,  Shinya YOSHIDA ,  Tatsuya KUNO ,  Seiya INOUE ,  Taro USAMI ,  Kenji YONEMOTO ,  Aoi SAITO

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: A member for a semiconductor manufacturing apparatus includes: a ceramic plate that has a wafer placement surface at an upper surface thereof; a plug disposition hole that extends through the ceramic plate in an up-down direction and that has a truncated conical space whose upper opening is larger than a lower opening thereof; a truncated conical plug that is disposed in the plug disposition hole, that allows gas to flow in the up-down direction, and whose upper surface is larger than a lower surface thereof; an adhesive layer that is provided between the plug disposition hole and the truncated conical plug; an electrically conductive baseplate that is joined to a lower surface of the ceramic plate through a joint layer; and a gas supply path that is provided in the baseplate and the joint layer and that supplies gas to the truncated conical plug.

公开(公告)号：US20240038567A1

公开(公告)日：2024-02-01

申请号：US18170129

申请日：2023-02-16

Applicant: NGK Insulators, Ltd.

Inventor： Seiya INOUE ,  Tatsuya KUNO ,  Natsuki HIRATA ,  Kenji YONEMOTO

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01J37/32724

Abstract: A member for a semiconductor manufacturing apparatus, includes: a ceramic plate that has a ceramic plate through hole; an electroconductive base plate that has a base plate through hole and that is disposed on a lower surface side of the ceramic plate; an insulating sleeve which is inserted into the base plate through hole and of which an outer peripheral surface is adhered to an inner peripheral surface of the base plate through hole via an adhesion layer; and a sleeve through hole that passes through the insulating sleeve in the up-down direction and that communicates with the ceramic plate through hole. The insulating sleeve has a tool engaging portion that is engageable with an external tool, and upon being engaged with the external tool, the tool engaging portion transmits rotation torque of the external tool to the insulating sleeve.

公开(公告)号：US20240297062A1

公开(公告)日：2024-09-05

申请号：US18582759

申请日：2024-02-21

Applicant: NGK INSULATORS, LTD.

Inventor： Seiya INOUE ,  Tatsuya KUNO ,  Masaki ISHIKAWA ,  Taro USAMI ,  Ren NAKAMURA ,  Natsuki HIRATA ,  Kenji YONEMOTO

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: A wafer placement table includes a ceramic plate having a wafer placement surface on its top surface and incorporating an electrode; an electrically conductive plate joined to a bottom surface of the ceramic plate; a ceramic plate penetrating part extending through the ceramic plate; an electrically insulating gas passage plug provided in the ceramic plate penetrating part and that allows gas to pass inside; a gas introduction passage provided at least inside the electrically conductive plate and communicating with the ceramic plate penetrating part; and an electrically conductive gas passage part provided in the gas introduction passage, being in contact with a bottom surface of the electrically insulating gas passage plug, being electrically continuous with the electrically conductive plate, and that allows gas to pass inside.

公开(公告)号：US20220216086A1

公开(公告)日：2022-07-07

申请号：US17457092

申请日：2021-12-01

Applicant: NGK INSULATORS, LTD.

Inventor： Masaki ISHIKAWA ,  Yuji AKATSUKA ,  Kenji YONEMOTO

IPC: H01L21/683 ,  H01J37/32 ,  C09J5/06

Abstract: A member for semiconductor manufacturing apparatus, includes: a ceramic plate having a wafer placement surface; a plug receiving hole formed in a surface of the ceramic plate opposite to the wafer placement surface; a gas outlet port extending through a bottom wall of the plug receiving hole; a plug received in the plug receiving hole; and a gas flow path disposed inside the plug to be continuous with the gas outlet port, wherein a stepped portion is disposed on a side surface of the plug or an inner surface of the plug receiving hole, the plug receiving hole and the plug are in contact with each other in an area deeper than the stepped portion, a gap is formed between the plug receiving hole and the plug in an area shallower than the stepped portion, and a plug support member made of an adhesive material is formed in the gap.