公开(公告)号：US20200212272A1

公开(公告)日：2020-07-02

申请号：US16724465

申请日：2019-12-23

Applicant: NICHIA CORPORATION

Inventor： Katsuyuki TSUNANO ,  Daisuke NIKI ,  Masafumi KURAMOTO

IPC: H01L33/54 ,  H01L33/20

Abstract: A method for producing a light emitting device, including: integrally molding plural leads with a molded resin portion comprising a resin composition containing a thermosetting resin or a thermoplastic resin, so as to prepare a substrate having a concave portion having a side surface and a bottom surface; disposing a light emitting element on the bottom surface of the concave portion; forming a film including a metal oxide on the side surface of the concave portion and an upper surface of the substrate; disposing a sealing resin composition containing an addition curing silicone resin composition containing an organopolysiloxane containing a functional group capable of performing a crosslinking reaction and an aryl group in one molecule, and an organic modified silicone oil that is unreactive with the organopolysiloxane, in the concave portion; and curing the sealing resin composition to form a resin package.