公开(公告)号：US20220328741A1

公开(公告)日：2022-10-13

申请号：US17702245

申请日：2022-03-23

Applicant: NICHIA CORPORATION

Inventor： Koji ABE ,  Kazusa NISHIUCHI

IPC: H01L33/62 ,  H01L33/56 ,  H01L25/075 ,  H01L33/00 ,  H01L33/60

Abstract: A method of manufacturing a light emitting module includes: providing a wiring board having an upper face on which a plurality of light emitting elements are mounted; disposing a first resin in an area of the upper face of the wiring board that is outward of a region in which the light emitting elements are mounted, wherein the first resin contains a light reflecting substance; and covering lateral faces of the light emitting elements with the first resin by spreading the first resin over the region in which the light emitting elements are mounted.