公开(公告)号：US20230387343A1

公开(公告)日：2023-11-30

申请号：US18306348

申请日：2023-04-25

Applicant: NICHIA CORPORATION

Inventor： Koji NISHINO

IPC: H01L33/00 ,  H01L21/66

CPC classification number: H01L33/005 ,  H01L22/12 ,  H01L22/14 ,  H01L2933/0066

Abstract: A method for manufacturing a light-emitting device includes: providing a plurality of first light-emitting elements, each comprising a joining portion containing gold; providing a support member including: a substrate, and a plurality of wiring portions, each disposed on the substrate and containing gold; joining the joining portions of the first light-emitting elements and corresponding wiring portions of the plurality of wiring portions under a first joining condition; evaluating whether at least one first light-emitting element of the plurality of first light-emitting elements is removable from the support member; evaluating electrical characteristics of each of the plurality of first light-emitting elements; and if the at least one first light-emitting element is removed from the support member, removing from the support member a first light-emitting element determined to be defective in the step of evaluating electrical characteristics of each of the plurality of first light-emitting elements.

公开(公告)号：US20230099246A1

公开(公告)日：2023-03-30

申请号：US17891132

申请日：2022-08-19

Applicant: NICHIA CORPORATION

Inventor： Hiroaki KAGEYAMA ,  Koji NISHINO ,  Kenji OZEKI

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

Abstract: A method for manufacturing a light-emitting device includes preparing first and second members. The first member includes first elements having first bonding parts. The second member includes a wiring substrate and second bonding parts. The method includes bonding the first bonding part and the second bonding part at a first bonding condition. The method includes evaluating an electrical characteristic of the first elements. The method includes removing, from the wiring substrate, a defective first element determined by the evaluation to be defective. The method includes placing a second element having a third bonding part on a region of the wiring substrate at which the defective first element had been removed. The method includes bonding the first bonding part and the second bonding part, and the third bonding part and the second bonding part at a second bonding condition.

公开(公告)号：US20240178343A1

公开(公告)日：2024-05-30

申请号：US18485745

申请日：2023-10-12

Applicant: NICHIA CORPORATION

Inventor： Koji NISHINO ,  Yoshinori KASHIMA ,  Noriyuki NAKASHIMA ,  Kenta NISHII ,  Masaki NAGAO

IPC: H01L33/00

CPC classification number: H01L33/007 ,  H01L2933/0041

Abstract: A method for manufacturing the light-emitting device includes: preparing a substrate including a plurality of light-emitting elements disposed in an element placement region of the substrate that is on an upper surface; disposing a light-transmissive member to cover the plurality of light-emitting elements, the light-transmissive member having a rectangular shape in a plan view and being uncured, and pressing one or more corner regions of the light-transmissive member, such that a part of a lower surface of the light-transmissive member is in contact with the upper surface of the substrate outside the element placement region; and curing the light-transmissive member after pressing the one or more corner regions.