公开(公告)号：US10181459B2

公开(公告)日：2019-01-15

申请号：US15346257

申请日：2016-11-08

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Takakazu Kono ,  Kunihito Sugimoto

IPC: H01L25/16 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/46 ,  H01L29/866

Abstract: A method of manufacturing a light-emitting device incudes providing a supporting member having a recess; disposing a light-emitting element at a bottom surface of the recess; disposing a first light-reflecting resin at the bottom surface of the recess; disposing a second light-reflecting resin in the recess, a viscosity of the second light-reflecting resin being higher than a viscosity of the first light-reflecting resin; and curing the first light-reflecting resin and the second light-reflecting resin to form a light-reflecting wall.