公开(公告)号：US20240413542A1

公开(公告)日：2024-12-12

申请号：US18696837

申请日：2022-12-02

Applicant: NIFCO INC.

Inventor： Makoto MURANAKA ,  Tatsuro FUJIU

IPC: H01Q17/00

Abstract: Provided is a radio wave absorber for a high-frequency communication apparatus that can improve mass productivity, reduce costs, and further achieve weight reduction. For this purpose, a radio wave absorber includes a side part surrounding a semiconductor element fixed to a base part provided in a high-frequency communication apparatus and a top part closing an open face surrounded by the side part. An inner face of the top part is provided with a plurality of protruding parts protruding toward the semiconductor element positioned inside the radio wave absorber, positioned spaced apart from the semiconductor element, and periodically arranged. The protruding parts are formed to be tapered toward the semiconductor element and are integrally molded of a synthetic resin.