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1.发明公开公开(公告)号：US20230317747A1
公开(公告)日：2023-10-05
申请号：US18207357
申请日：2023-06-08
发明人： Mingzhu WANG , Nan GUO , Zhenyu CHEN , Takehiko TANAKA , Jingfei HE , Zhen HUANG , Zhongyu LUAN , Feifan CHEN
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H04M1/0264 , H05K1/181 , H04N23/51 , H04N23/54 , H04N23/57 , H05K2201/10121
摘要： A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.
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2.发明申请公开(公告)号：US20220109018A1
公开(公告)日：2022-04-07
申请号：US17550733
申请日：2021-12-14
发明人： Mingzhu WANG , Nan GUO , Zhenyu CHEN , Takehiko TANAKA , Jingfei HE , Zhen HUANG , Zhongyu LUAN , Feifan CHEN
IPC分类号： H01L27/146 , H04N5/225 , H04M1/02 , H05K1/18
摘要： A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.
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3.发明申请公开(公告)号：US20210167105A1
公开(公告)日：2021-06-03
申请号：US16613571
申请日：2018-05-18
发明人： Mingzhu WANG , Nan GUO , Zhenyu CHEN , Takehiko TANAKA , Jingfei HE , Zhen HUANG , Zhongyu LUAN , Feifan CHEN
IPC分类号： H01L27/146 , H04N5/225 , H04M1/02 , H05K1/18
摘要： A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.
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