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1.发明申请公开(公告)号：US20220264073A9
公开(公告)日：2022-08-18
申请号：US16856000
申请日：2020-04-22
发明人： Kouwen ZHANG , Baozhong ZHANG , Huanbiao ZHOU , Qiang LI , Ding LU , Junjie ZENG , Peng LU , Zhifu YU , Bainian CHU
IPC分类号： H04N13/254 , H04N13/30 , H01L33/64 , H02J7/00 , G01B11/25 , G02B7/04 , G03B35/18 , F21V5/00 , F21V13/04 , G02B27/42 , H04N5/225
摘要： A light-deflection three-dimensional imaging device, a projection device, and the application thereof are disclosed. The light-deflection three-dimensional imaging device includes a projection device, a receiving device and a processor. The projection device includes a light source, a grating, a condensing lens group, a light deflection element and an emission lens, wherein after the modulation by the grating, the aggregation by the condensing lens group and the deflection by the light deflection element, the projection light transmitted by the light source penetrates the emission lens and is emitted from a side surface of the projection device. The light deflection element is provided to change a projection path of light emitted from the light source, thereby changing an installation manner of the projection device, so that the thickness thereof is significantly reduced, thereby facilitating the installation in lighter and thinner electronic mobile devices, such as a mobile phone, a laptop, a tablet computer, etc.
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公开(公告)号：US20210185804A1
公开(公告)日：2021-06-17
申请号：US17182353
申请日：2021-02-23
发明人： Zhen HUANG , Junjie ZENG , Chenxiang XU , Feifan CHEN
IPC分类号： H05K1/02 , G03B30/00 , G01S17/894 , H04N5/225
摘要： The present disclosure provides a circuit board assembly, a TOF camera module including the circuit board assembly and applications thereof. The circuit board assembly is used to support an electronic component, and includes a conductive portion and an insulating portion. The insulating portion is integrally bonded to the conductive portion, and the conductive portion extends through the insulating portion. The electronic component is supported by the conductive portion and is communicated with the conductive portion, so that the electronic component directly dissipates heat through the conductive portion during operation.
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3.发明申请公开(公告)号：US20200322589A1
公开(公告)日：2020-10-08
申请号：US16856000
申请日：2020-04-22
发明人： Kouwen ZHANG , Baozhong ZHANG , Huanbiao ZHOU , Qiang LI , Ding LU , Junjie ZENG , Peng LU , Zhifu YU , Bainian CHU
IPC分类号： H04N13/254 , H04N13/30 , H01L33/64 , H02J7/00 , G01B11/25 , G02B7/04 , G03B35/18 , F21V5/00 , F21V13/04 , G02B27/42 , H04N5/225
摘要： A light-deflection three-dimensional imaging device, a projection device, and the application thereof are disclosed. The light-deflection three-dimensional imaging device includes a projection device, a receiving device and a processor. The projection device includes a light source, a grating, a condensing lens group, a light deflection element and an emission lens, wherein after the modulation by the grating, the aggregation by the condensing lens group and the deflection by the light deflection element, the projection light transmitted by the light source penetrates the emission lens and is emitted from a side surface of the projection device. The light deflection element is provided to change a projection path of light emitted from the light source, thereby changing an installation manner of the projection device, so that the thickness thereof is significantly reduced, thereby facilitating the installation in lighter and thinner electronic mobile devices, such as a mobile phone, a laptop, a tablet computer, etc.
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4.发明申请公开(公告)号：US20200003870A1
公开(公告)日：2020-01-02
申请号：US16429309
申请日：2019-06-03
发明人： Feifan CHEN , Zhongwei WANG , Qi RONG , Junjie ZENG , Hangang WEI , Beibei DAI , Minjie PAN
摘要： Provided are a depth information camera module and a base assembly, a projection assembly, an electronic device and a manufacturing method thereof. The depth information camera module includes: a projection assembly to project a laser to a to-be-detected object; a receiving assembly, including a photosensitive element for receiving the laser reflected from the to-be-detected object; and a base assembly, the base assembly including a circuit board and a base body, the base body being supported by the circuit board, where the photosensitive element is electrically connected to the circuit board, the projection assembly circuit board is supported on a top side of the base body such that the circuit board and the projection assembly circuit board are respectively at different heights of the base assembly. Here, the projection assembly has an integral structure to facilitate assembly of the projection assembly.
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5.发明申请公开(公告)号：US20170094257A1
公开(公告)日：2017-03-30
申请号：US15309202
申请日：2015-05-06
发明人： Kouwen ZHANG , Baozhong ZHANG , Huanbiao ZHOU , Qiang LI , Jie ZHENG , Ding LU , Junjie ZENG , Peng LU , Zhifu YU , Bainian CHU , Zongze WANG
摘要： A light-deflection three-dimensional imaging device and a projection device, and the application thereof are provided. The light-deflection three-dimensional imaging device includes a projection device, a receiving device and a processor. The projection device includes a light source, a grating, a condensing lens group, a light deflection element and an emission lens, wherein after the modulation by the grating, the aggregation by the condensing lens group and the deflection by the light deflection element, the projection light transmitted by the light source penetrates the emission lens and is emitted from a side surface of the projection device. The light deflection element is provided to change a projection path of light emitted from the light source, thereby changing an installation manner of the projection device, so that the thickness thereof is significantly reduced, thereby facilitating the installation in lighter and thinner electronic mobile devices, such as a mobile phone, a laptop, a tablet computer, etc.
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