公开(公告)号：US20230043755A1

公开(公告)日：2023-02-09

申请号：US17787847

申请日：2020-11-10

申请人： NIPPON DENKAI, LTD.

发明人： Toshio KAWASAKI ,  Yasuhiro ENDO

IPC分类号： C25D5/12 ,  C23C28/00 ,  C25D5/16 ,  C25D5/48 ,  C25D7/06 ,  C25D5/00 ,  H05K1/09 ,  H05K3/38

摘要： Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.

公开(公告)号：US20220112618A1

公开(公告)日：2022-04-14

申请号：US17311231

申请日：2019-12-03

申请人： NIPPON DENKAI, LTD.

发明人： Toshio KAWASAKI ,  Tsuyoshi ONUMA ,  Yasuhiro ENDO

IPC分类号： C25D1/04 ,  H01M4/66

摘要： An electrolytic copper foil having higher electrical conductivity, and a method for producing the same are provided. The electrolytic copper foil according the present invention has a carbon content of 5 ppm or less, a sulfur content of 3 ppm or less, an oxygen content of 5 ppm or less, and a nitrogen content of 0.5 ppm or less; has a total content of carbon, sulfur, oxygen, nitrogen, and hydrogen of 15 ppm or less; and has a number of grains of 8.0 to 12.0/μm2, the number of grains changing to 0.6 to 1.0/μm2 by heating the electrolytic copper foil at 150° C. for 1 hour. A method for producing this electrolytic copper foil includes cleaning a copper raw material; dissolving the copper raw material after the cleaning to obtain an electrolytic solution having a total organic carbon (TOC) of 10 ppm or less; and electrolyzing the electrolytic solution to obtain the electrolytic copper foil.

公开(公告)号：US20240308183A1

公开(公告)日：2024-09-19

申请号：US18546748

申请日：2022-02-04

申请人： NIPPON DENKAI, LTD.

发明人： Yasuhiro ENDO ,  Shota MOROE ,  Sayaka KINOSHITA

IPC分类号： B32B15/20 ,  B32B15/04 ,  B32B15/08

CPC分类号： B32B15/20 ,  B32B15/043 ,  B32B15/08 ,  B32B2307/20 ,  B32B2311/12

摘要： A surface-treated copper foil which maintains peel strength against the resin substrate of the surface-treated copper foil and achieves desired low transmission loss even at high frequencies is provided. The surface-treated copper foil of the present invention includes an electrolytic copper foil, at least one roughened layer that covers one surface of the electrolytic copper foil, an anti-rust layer that covers the at least one roughened layer, and a silane coupling agent-treated layer that covers the anti-rust layer, in which a surface of the surface-treated copper foil on a side of the layers (the surface to be bonded to the resin substrate) has a developed interfacial area ratio Sdr of 40% or less, an arithmetic mean peak curvature Spc of 200 mm−1 or less and a root mean square gradient Sdq of 0.30 to 0.90, or particles on the surface to be bonded of the surface-treated copper foil have an average particle size of 0.50 μm or less and an average particle length of 0.40 to 0.70 μm.