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公开(公告)号：US20240359993A1
公开(公告)日：2024-10-31
申请号：US18681649
申请日：2022-07-27
发明人： Keiko YOSHITAKE , Kazuya KUROIWA
IPC分类号： C01B33/149
CPC分类号： C01B33/149 , C01P2006/22
摘要： A silica sol dispersed in a nonaqueous solvent, especially a hydrophobic solvent, to improve the compatibility with organic materials, and method for producing the same; the silica sol containing alkali, in which at least two types of alkoxy groups of Si—OR0 and Si—OR1 (provided that R0 is a C1-4 alkyl group, R1 is a C2-10 organic group which arbitrarily has an oxygen atom, and R0 and R1 are not the same chemical group) are present on or near a surface of silane-coated silica particles, the silica particles having a molar ratio (Si—OR1)/(Si—OR0) of 0.17 to 10 are used as dispersoids, and at least one hydrophobic organic solvent selected from the group consisting of ketones, ethers, esters, amides, and hydrocarbons is used as a dispersion medium.
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2.发明申请公开(公告)号：US20230045117A1
公开(公告)日：2023-02-09
申请号：US17788011
申请日：2021-11-04
发明人： Kazuya KUROIWA , Hikaru ONISHI , Yuki SUGAWARA , Naohiko SUEMURA
IPC分类号： C01B33/145 , C01B33/146 , C09D7/62 , H01B3/30 , C09D179/08
摘要： A silica sol dispersed in a nitrogen-containing solvent and a silica-containing resin composition containing a nitrogen atom-containing polymer. A silica sol including silica particles containing aluminum atoms and having an average primary particle diameter of 5 to 100 nm, the silica particles being dispersed in a nitrogen-containing solvent, wherein the aluminum atoms are bonded to the surfaces of the silica particles in an amount in terms of Al2O3 of 800 to 10,000 ppm/SiO2. The silica particles are bonded to a silane compound or a hydrolysate of the silane compound. The nitrogen-containing solvent is an amide solvent. The nitrogen-containing solvent is dimethylacetamide, dimethylformamide, N-methylpyrrolidone, or N-ethylpyrrolidone. The insulating resin composition includes the silica sol and a nitrogen-containing polymer. The nitrogen-containing polymer is polyimide, polyamide, polyamic acid, polyamideimide, polyetherimide, or polyesterimide. An insulation-coated conductor wire produced by insulation coating of a conductor wire with the insulating resin composition.
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公开(公告)号：US20210309834A1
公开(公告)日：2021-10-07
申请号：US17270926
申请日：2020-05-13
IPC分类号： C08K9/04 , C01B33/146 , C01B33/145 , C09C1/30 , C08K3/36
摘要： A silica-blended resin varnish contains a silica sol with a high dispersibility that is dispersed in a ketone organic solvent, in a nitrogen atom-containing polymer. The particles have an average size of 5 to 100 nm and have a carbon-carbon unsaturated bond-containing organic group and an alkoxy group bonded to surfaces thereof. The carbon-carbon unsaturated bond-containing organic group is bonded at 0.5 to 2.0 groups per unit area (nm2) of the particle surfaces. The alkoxy group is bonded at 0.1 to 2.0 groups per unit area (nm2) of the particle surfaces. The molar ratio of {(the carbon-carbon unsaturated bond-containing organic group)/(the alkoxy group)} is 0.5 to 5.0. The carbon-carbon unsaturated bond-containing organic group may be a phenyl group-containing organic group or a (meth)acryloyl group-containing organic group. An insulating resin composition contains the silica sol and a nitrogen-containing polymer, which may be polyimide, polyamide, polyamic acid, polyamide-imide, polyetherimide, or polyesterimide.
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